Patents by Inventor Kang Lan

Kang Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230416764
    Abstract: The present invention refers to a method of producing globin polypeptide recombinantly and a method of producing globin polypeptide with a cell-free translation system. Further, the present invention provides a food product, preferably a meat substitute food product. The present invention is also directed to a vector and a system for recombinant globin polypeptide production as well as to a cell comprising a recombinant expression vector or one or more recombinant nucleic acid molecule(s).
    Type: Application
    Filed: December 2, 2021
    Publication date: December 28, 2023
    Applicant: PLANEAT FOODS PTE. LTD.
    Inventors: Tuck Seng WONG, Kang Lan TEE, Margit LANGWALLNER, Madhavan NALLANI, Christoph LANGWALLNER
  • Patent number: 11655204
    Abstract: A novel promotor which contains an aniline derivative is introduced. By using the promotor alone, the time and temperature of the curing reaction of the vinyl ester resin can be controlled by the unique steric effect and electronic properties of the aniline derivative. A method for preparing the above promotor is also introduced.
    Type: Grant
    Filed: February 21, 2021
    Date of Patent: May 23, 2023
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yi-Kang Lan, Chi-Wi Ong, Yong-Yun Zhang
  • Publication number: 20220267250
    Abstract: A novel promotor which contains an aniline derivative is introduced. By using the promotor alone, the time and temperature of the curing reaction of the vinyl ester resin can be controlled by the unique steric effect and electronic properties of the aniline derivative. A method for preparing the above promotor is also introduced.
    Type: Application
    Filed: February 21, 2021
    Publication date: August 25, 2022
    Inventors: YI-KANG LAN, CHI-WI ONG, YONG-YUN ZHANG
  • Patent number: 10793686
    Abstract: A preparation method of vinyl ester resin for optimizing heat-release during curing includes: (A) providing a vinyl ester, a solvent and a phase change material to perform mixture; (B) performing a heating process to remove the solvent, so as to obtain a vinyl ester resin containing the phase change material. Thereby, the organic PCM material with high heat absorption and good resin affinity can be used as the temperature control agent of the vinyl ester resin during the curing process for avoiding the defects such as bubbles and cracks being generated in the vinyl ester resin.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: October 6, 2020
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Yi-Kang Lan, Shyh-Jang Sun, Cheng-Huan Wang, Jr-Jeng Ruan, Yung-Chin Chien, Kai-Chia Yeh
  • Publication number: 20200181337
    Abstract: A preparation method of vinyl ester resin for optimizing heat-release during curing includes: (A) providing a vinyl ester, a solvent and a phase change material to perform mixture; (B) performing a heating process to remove the solvent, so as to obtain a vinyl ester resin containing the phase change material. Thereby, the organic PCM material with high heat absorption and good resin affinity can be used as the temperature control agent of the vinyl ester resin during the curing process for avoiding the defects such as bubbles and cracks being generated in the vinyl ester resin.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 11, 2020
    Inventors: Yi-Kang Lan, Shyh-Jang Sun, Cheng-Huan Wang, Jr-Jeng Ruan, Yung-Chin Chien, Kai-Chia Yeh
  • Publication number: 20100225547
    Abstract: An antenna assembly for use in a vehicle is provided, whereby the assembly is preferably concealed within a vehicle bumper or non-conductive fender. The assembly includes a flexible antenna radiator directly connected with an output of a tunable matching circuit contained within a housing, whereby the housing further provides a connection means between the input of the matching circuit and a radio system in the vehicle. The matching circuit is tunable by control means provided externally on the housing, enabling the antenna assembly to be easily tuned prior to or during installation. The inventive antenna assembly advantageously provides a low cost antenna with ease of installation, small size, and direct integration with a tunable matching circuit.
    Type: Application
    Filed: March 5, 2009
    Publication date: September 9, 2010
    Inventors: Kang Lan, Harry Guo, Jan Koivunen, Rudolf F. Riemann
  • Patent number: 7202829
    Abstract: A wide band mobile antenna assembly having a whip, a base defining a housing, an adaptor extending on top of the base above the housing, and a mounting element extending in the housing. The mounting element has two opposite PCB mounting side surfaces and two opposite coil mounting surfaces. A PCB is mounted on each of the corresponding PCB mounting side surfaces. A matching circuitry is integrated on the two PCBs. The matching circuitry has a conductor for connection to the whip when the whip is inserted in the adaptor, and a conductor for external cable connection. The matching circuitry has a series resonant network operatively connected to a parallel resonant network for increasing a bandwidth of the antenna assembly. The series and resonant networks each have a coil mounted to the corresponding coil mounting surface.
    Type: Grant
    Filed: September 6, 2005
    Date of Patent: April 10, 2007
    Assignee: Comprod Communications Ltd.
    Inventor: Kang Lan
  • Publication number: 20060049996
    Abstract: A wide band mobile antenna assembly having a whip, a base defining a housing, an adaptor extending on top of the base above the housing, and a mounting element extending in the housing. The mounting element has two opposite PCB mounting side surfaces and two opposite coil mounting surfaces. A PCB is mounted on each of the corresponding PCB mounting side surfaces. A matching circuitry is integrated on the two PCBs. The matching circuitry has a conductor for connection to the whip when the whip is inserted in the adaptor, and a conductor for external cable connection. The matching circuitry has a series resonant network operatively connected to a parallel resonant network for increasing a bandwidth of the antenna assembly. The series and resonant networks each have a coil mounted to the corresponding coil mounting surface.
    Type: Application
    Filed: September 6, 2005
    Publication date: March 9, 2006
    Inventor: Kang Lan
  • Patent number: D1016679
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: March 5, 2024
    Assignee: GUANGDONG GOBAO INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Qifang Zeng, Linqiang Lan, Kang Shen
  • Patent number: D1025048
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 30, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Zhan Bo Ren, Andreas Morlock, Xue Kang Li, Shi Kong Lin, Ting Li Lan, Yong Jie Sun
  • Patent number: D1025049
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 30, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Zhan Bo Ren, Andreas Morlock, Xue Kang Li, Shi Kong Lin, Ting Li Lan, Yong Jie Sun