Abstract: A scan driver includes a plurality of stages. An nth (n is a natural number) stage among the stages includes: a first and a second input circuit for controlling a voltage of a first node in response to a carry signal of a previous stage and a next stage, respectively; a first output circuit for outputting an nth carry signal corresponding to a carry clock signal in response to the voltage of the first node; a second output circuit for outputting an nth scan and an nth sensing signal corresponding to a scan and a sensing clock signal, respectively, in response to the voltage of the first node; and a sampling circuit for storing the carry signal of the previous stage in response to a first select signal, and for supplying a control voltage to the first node in response to a second select signal and the stored carry signal.

Abstract: Provided are a system for business process automation and a method thereof. The system according to some embodiments may include a connect manager configured to register and manage application programming interface (API) information for services, a process execution engine configured to execute a target business process comprising a particular service task, which is a task using a particular service provided by a service module, and a connect broker configured to acquire API information for the particular service, registered through the connect manager, during execution of the target business process in response to a request from the process execution engine, and process the particular service task by sending a request for the particular service to the service module using the acquired API information.

Abstract: A method for manufacturing a synthetic resin scouring pad includes hot extruding a polymer by thermally melting a synthetic resin, along a T die having a straight extrusion port, to form a full width film sheet; cold-curing the film sheet by impregnating and quenching the extruded full width film sheet with cooling water of a cooling bath; forming flat film filaments by passing the full width film sheet lengthwise through a cutting part in which cutting blades are arranged at a predetermined width so as to dividingly-cut the full width film sheet into a predetermined width; passing the flat film filaments in the longitudinal direction through a coiling forming part to plastic-deform the flat film filaments into coil-shaped film filaments; and inputting the coil-shaped film filaments into an annular winding part so that the film filaments are wound in an annular shape to form a synthetic resin scouring pad.

Abstract: A semiconductor device includes an insulated gate electrode pattern formed on a well region. The semiconductor device further includes a sidewall spacer formed on sidewalls of the gate electrode pattern. A source region and a drain region are formed adjacent opposite sides of the gate pattern. In accordance with one embodiment of the present invention, one of the source or drain regions includes a first-concentration impurity region formed under the sidewall spacer. The semiconductor device further includes a silicide layer formed within the well region wherein at least a part of the silicide layer contacts a portion of the well region to bias the well region. A method of manufacturing the semiconductor device is also provided.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device has a probing pad formed on a chip. The probing pad is connected to an output pad and an internal circuit though a fuse. After an electrical testing of the chip by the probing pad, the fuse is cut by a laser beam. Therefore, the probing pad is disconnected from the output pad and the internal circuit. The output pad is connected to an output lead of a package, which is encapsulating the chip. According to the device and the fabrication methods thereof, performance of the device can be enhanced by a low parasitic capacitance and a low parasitic resistance.

Abstract: A semiconductor device includes an insulated gate electrode pattern formed on a well region. The semiconductor device further includes a sidewall spacer formed on sidewalls of the gate electrode pattern. A source region and a drain region are formed adjacent opposite sides of the gate pattern. In accordance with one embodiment of the present invention, one of the source or drain regions includes a first-concentration impurity region formed under the sidewall spacer. The semiconductor device further includes a silicide layer formed within the well region wherein at least a part of the silicide layer contacts a portion of the well region to bias the well region. A method of manufacturing the semiconductor device is also provided.

Abstract: A semiconductor device includes a substrate of a first conductive type, and a well region of an opposite second conductive type is formed in the substrate. A first impurity region of the first conductive type extends to a first depth within the well region, and a second impurity region of the first conductive type is spaced from the first impurity region to define a channel region therebetween and extends to a second depth within the well region. Preferably, the second depth is greater than the first depth. A gate electrode is located over the channel region, and a silicide layer is formed at a third depth within the first impurity region. The third depth is less than the first depth, and a difference between the first depth and the third depth is less than or equal to a difference at which a leakage current from the silicide layer to the well region is sufficient to electrically bias the well region through the silicide layer.

Abstract: A semiconductor device includes an insulated gate electrode pattern formed on a well region. The semiconductor device further includes a sidewall spacer formed on sidewalls of the gate electrode pattern. A source region and a drain region are formed adjacent opposite sides of the gate pattern. In accordance with one embodiment of the present invention, one of the source or drain regions includes a first-concentration impurity region formed under the sidewall spacer. The semiconductor device further includes a silicide layer formed within the well region wherein at least a part of the silicide layer contacts a portion of the well region to bias the well region. A method of manufacturing the semiconductor device is also provided.

Abstract: A semiconductor device includes a substrate of a first conductive type, and a well region of an opposite second conductive type is formed in the substrate. A first impurity region of the first conductive type extends to a first depth within the well region, and a second impurity region of the first conductive type is spaced from the first impurity region to define a channel region therebetween and extends to a second depth within the well region. Preferably, the second depth is greater than the first depth. A gate electrode is located over the channel region, and a silicide layer is formed at a third depth within the first impurity region. The third depth is less than the first depth, and a difference between the first depth and the third depth is less than or equal to a difference at which a leakage current from the silicide layer to the well region is sufficient to electrically bias the well region through the silicide layer.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device has a probing pad formed on a chip. The probing pad is connected to an output pad and an internal circuit though a fuse. After an electrical testing of the chip by the probing pad, the fuse is cut by a laser beam. Therefore, the probing pad is disconnected from the output pad and the internal circuit. The output pad is connected to an output lead of a package, which is encapsulating the chip. According to the device and the fabrication methods thereof, performance of the device can be enhanced by a low parasitic capacitance and a low parasitic resistance.