Patents by Inventor Kang-youn Lee

Kang-youn Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7380560
    Abstract: Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: June 3, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In-joon Yeo, Il-sang Lee, Kang-youn Lee
  • Publication number: 20080047576
    Abstract: In a single-substrate type apparatus for processing a substrate, the apparatus includes a chamber, a bottom panel, a solution supplying part and a substrate holder. The chamber has an upper portion and a lower portion. The bottom panel is detachably connected to the lower portion. The solution supplying part is connected to the bottom panel to supply a processing solution to the substrate in the chamber. The substrate holder provides the substrate into the chamber, the substrate holder holding both side portions of the substrate such that the substrate is vertically arranged.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 28, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Ok KIM, Chang-Ki HONG, Kun-Tack LEE, In-Gi KIM, Woo-Gwan SHIM, Jeong-Nam HAN, Kang-Youn LEE
  • Publication number: 20040238000
    Abstract: Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.
    Type: Application
    Filed: May 11, 2004
    Publication date: December 2, 2004
    Inventors: In-joon Yeo, Il-sang Lee, Kang-youn Lee