Abstract: An imaging element package includes: an imaging element chip having an imaging surface; a substrate on which the imaging element chip is mounted; an optical member that allows light to pass; and a supporting body having a body portion where a through-opening serving as a light path for imaging is formed, and an attachment portion that is provided in the body portion and is to be attached to an attachment position. The substrate is attached to the body portion so as to close one end of the opening in a through direction in a state where the imaging surface faces another end from the one end of the opening in the through direction, and the optical member is attached to the body portion so as to close the other end of the opening in the through direction.

Abstract: An imaging element package includes: an imaging element chip having an imaging surface; a substrate on which the imaging element chip mounted; an optical member that allows light to pass; and a supporting body having a body portion where a through-opening serving as a light path for imaging is formed, and an attachment portion that is provided in the body portion and is to be attached to an attachment position. The substrate is attached to the body portion so as to close one end of the opening in a through direction in a state where the imaging surface faces another end from the one end of the opening in the through direction, and the optical member is attached to the body portion so as to close the another end of the opening in the through direction.

Abstract: A sealing resin for flip chip mounting. It permits a semiconductor chip to be mounted on a printed circuit board with high reliability. It contributes to high productivity and cost reduction in flip chip mounting. When in use for flip chip mounting, it fills the gap between a semiconductor chip and a printed circuit board, thereby sealing solder connections between them. It comprises an epoxy resin, an acid anhydride hardener to cure said epoxy resin, a flux to remove oxide film from solder bumps or solder balls on the semiconductor chip and printed circuit board, and an inorganic particulate filler with an average diameter ranging from 10 &mgr;m to 20 &mgr;m.

Abstract: A semiconductor device in a chip size package form having a high durability and reliability and realizing a small size with high density, and an electronic apparatus mounting the same, connected to a motherboard by soldering, comprising a semiconductor chip wherein bumps are formed on pad portions thereof; an interposer supporting the bumps mechanically and having through-holes wherein conductors are formed and connected to the bumps electrically; and a sealing resin buried between the semiconductor chip and the interposer, wherein the interposer is formed from a material having a higher glass transition temperature than a curing temperature of the sealing resin, a coefficient of linear expansion of the interposer is of a value substantially intermediate between that of the motherboard and that of the semiconductor chip, and/or the interposer is formed from a material having a bending strength of 400 MPa or more.

Abstract: A semiconductor device including a semiconductor element having a plurality of pads, and a method of manufacturing the semiconductor device. The semiconductor element includes a plurality of wiring portions, each being conducted to one of the pads, which are formed on a pad-formed surface of the semiconductor element; and a plurality of bumps, each being formed at a specified position of one of the wiring portions. Accordingly, it is possible to solve an inconvenience due to a difference in linear expansion coefficient between the semiconductor element and a circuit board and ensure a sufficient reliability; and to sufficiently make full use of the effect of high mounting density by flip chip mounting at a low cost.

Abstract: A semiconductor device including a semiconductor element having a plurality of pads, and a method of manufacturing the semiconductor device. The semiconductor element includes a plurality of wiring portions, each being conducted to one of the pads, which are formed on a pad-formed surface of the semiconductor element; and a plurality of bumps, each being formed at a specified position of one of the wiring portions. Accordingly, it is possible to solve the problem of difference in linear expansion coefficient between the semiconductor element and a circuit board and ensure a sufficient reliability; and to sufficiently make full use of the effect of high mounting density by flip chip mounting at a low cost.