Patents by Inventor Kaoru Kitadono

Kaoru Kitadono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5561186
    Abstract: A resin composition having an improved recycling property comprising;(a) from 5 to 95 parts by weight of a poly-phenylene ether,(b) from 95 to 5 parts by weight of a polyamide,(c) from 0 to 30 parts by weight per 100 parts by weight of [(a)+(b)] of a compatibilizing agent,(d) from 0.001 to 10 parts by weight per 100 parts by weight of [(a)+(b)] of an alkali earth metal oxide,(e) from 0 to 100 parts by weight per 100 parts by weight of [(a)+(b)] of a rubbery material, and(f) from 0 to 200 parts by weight per 100 parts by weight of [(a)+(b)] of an inorganic filler.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: October 1, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kenji Nagaoka, Kaoru Kitadono, Yasuro Suzuki
  • Patent number: 5554677
    Abstract: A blow-molded article made from a polyphenylene ether/polyamide composition reinforced with glass fibers is provided. The article is excellent in mechanical properties and blow moldability. The composition comprises a mixture consisting of (A) 10-65 parts by weight of a polyphenylene ether and (B) 90-35 parts by weight of a polyamide and, on the basis of 100 parts by weight of said mixture, (C) 10-100 parts by weight of a glass fiber, (D) 1-35 parts by weight of a polyolefin and (E) 0.01-10 parts by weight of an unsaturated polar monomer compound having in its molecule both (a) carbon-carbon double bond or carbon-carbon triple bond and (b) carboxyl group, acid anhydride group, amino group, acid amide group, imide group, epoxy group, carboxylic acid ester group, isocyanate group, methylol group or hydroxyl group as a compatibilizing agent, amounts of (C), (D) and (E) being based on 100 parts by weight of [(A)+(B)].
    Type: Grant
    Filed: March 7, 1995
    Date of Patent: September 10, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kenji Nagaoka, Hiroshi Hagimori, Kaoru Kitadono
  • Patent number: 5523342
    Abstract: The invention describes a thermoplastic composition made of a continuous phase made of crystalline thermoplastic resin A, a dispersed phase made of polyphenylene ether resin B, and an amide compound C represented by formula 1,R.sub.4 --CONH--R.sub.2 --HNOC--R.sub.1 --CONH--R.sub.3 --HNOC--R.sub.5(1)wherein R.sub.1, R.sub.2, and R.sub.3 represent divalent hydrocarbon groups, which may be identical or different, and R.sub.4 and R.sub.5 represent monovalent hydrocarbon groups, which may be identical or different. The amide compound is present in an amount between about 0.1 and about 30 parts by weight per 100 parts by weight of the resins A and B mixed together.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: June 4, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kenji Nagaoka, Kaoru Kitadono
  • Patent number: 5496863
    Abstract: A method of crosslinking a rubber or plastic molding is described, which comprises irradiating the molding with electron beams to thereby limitedly crosslink only the surface of the molding. The molding thus-treated has excellent shape-sustaining properties and good surface appearance. Thus it is expected to find many applications in various fields.
    Type: Grant
    Filed: March 12, 1991
    Date of Patent: March 5, 1996
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Yoshihiko Kitagawa, Tadashi Jinno, Masashi Aoshima, Taisuke Okita, Hideo Shinonaga, Kaoru Kitadono
  • Patent number: 5464891
    Abstract: The invention describes a thermoplastic composition made of a continuous phase made of crystalline thermoplastic resin A, a dispersed phase made of polyphenylene ether resin B, and an amide compound C represented by formula 1,R.sub.4 --CONH--R.sub.2 --HNOC--R.sub.1 --CONH--R.sub.3 --HNOC--R.sub.5( 1)wherein R.sub.1, R.sub.2, and R.sub.3 represent divalent hydrocarbon groups, which may be identical or different, and R.sub.4 and R.sub.5 represent monovalent hydrocarbon groups, which may be identical or different. The amide compound is present in an amount between about 0.1 and about 30 parts by weight per 100 parts by weight of the resins A and B mixed together.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: November 7, 1995
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Kenji Nagaoka, Kaoru Kitadono
  • Patent number: 5459189
    Abstract: A resin composition having improved resistance to discoloration caused by exposure to light, which comprises (a) 5-95% by weight of a polyphenylene ether alone or in combination with a styrene polymer, (b) 95-5% by weight of a polyamide, and based on 100 parts by weight of the sum of (a) and (b), (c) 0.01-30 parts by weight of one or more agents to improve the compatibility of a polyphenylene ether and a polyamide, (d) 0-50 parts by weight of one or more agents to improve the impact resistance, and (e) 0.1-15 parts by weight of metal particles having 10 .mu.m or less of weight average particle size and 3 or more of aspect ratio, and 60% by weight or more of (e) metal particles being included in (b) a polyamide.
    Type: Grant
    Filed: January 24, 1994
    Date of Patent: October 17, 1995
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Hiroshi Hagimori, Yasuro Suzuki, Kaoru Kitadono, Takashi Sanada
  • Patent number: 5352737
    Abstract: The present invention provides a resin composition which is excellent in adhesion to coatings and which comprises the following components:(a) a polyphenylene ether in an amount of 10-90 parts by weight,(b) a polyamide in an amount of 90-10 parts by weight,(c) a compatibilizing agent in an amount of 0.01-10 parts by weight based on 100 parts by weight of ((a)+(b)),(d) an unsaturated acid salt of a metal belonging to Groups I-III of the periodic table in an amount of 0.2-10 parts by weight based on 100 parts by weight of ((a)+(b)), and(e) a rubber material in an amount of 0-100 parts by weight based on 100 parts by weight of ((a)+(b)).
    Type: Grant
    Filed: December 1, 1993
    Date of Patent: October 4, 1994
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Kenji Nagaoka, Yasuro Suzuki, Kaoru Kitadono
  • Patent number: 5175211
    Abstract: A thermoplastic resin composition comprises a polyphenylene ether having a reduced viscosity within the range of 0.30 dl/g or more and less than 0.45 dl/g, an aliphatic polyamide, a specified compatibilizing agent, and a rubber material. The composition has a high in heat distortion temperature and is superior in processability.
    Type: Grant
    Filed: May 17, 1991
    Date of Patent: December 29, 1992
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Takashi Sanada, Kaoru Kitadono, Yasurou Suzuki, Taichi Nishio, Hiroomi Abe, Noriyasu Kagawa
  • Patent number: 5139817
    Abstract: A method for surface treating a thermoplastic resin shaped article is disclosed, which comprises irradiating a surface of the shaped article with an ultraviolet light having a wavelength of 300 nm or less, said shaped article being obtained from a resin composition comprising (I) 100 parts by weight of a resin comprising from 5 to 100% by weight of a polyphenylene ether resin, a mixture of a polyphenylene ether resin and a styrene resin; or a graft copolymer of a polyphenylene ether resin and styrene and from 95 to 0% by weight of at least one thermoplastic resin selected from the group consisting of a polyamide resin and a saturated polyester resin; (II) from ) 0 to 50 parts by weight of a rubbery substance; (III) from 0 to 50 parts by weight of an inorganic filler and/or glass fibers; and (IV) from 0 to 10 parts by weight of at least one compatibilizer for improving the compatibility between said polyphenylene ether resin and said polyamide resin and/or saturated polyester resin.
    Type: Grant
    Filed: March 13, 1991
    Date of Patent: August 18, 1992
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Hiroomi Abe, Hideo Shinonaga, Kaoru Kitadono, Yasuro Suzuki, Satoru Sogabe
  • Patent number: 5086105
    Abstract: The present invention provides a filler-containing thermoplastic resin composition which is well balanced in dimensinoal stability, rigidity, heat resistance and impact strength. This composition comprises: (I) 100 parts by weight of a resin comprising 5-95% by weight of a polyphenylene ether resin, a mixture of a polyphenylene ether resin and a styrene resin or a graft polymer of a polyphenylene ether resin and styrene and 95-5% by weight of polyamide resin, (II) 0-50 parts by weight of a rubber-like material, (III) 2.0-50 parts by weight of an inorganic filler having an average particle size of 5.0.mu. or less and/or a glass fiber and (IV) 0.01-10 parts by weight of at least one compatibilizing agent which improves compatibility between the polyphenylene resin and the polyamide resin. Talc is preferred as the inorganic filler.
    Type: Grant
    Filed: December 11, 1989
    Date of Patent: February 4, 1992
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Hiroomi Abe, Taichi Nishio, Kaoru Kitadono
  • Patent number: 5073620
    Abstract: (A) 10-70 parts by weight of a polyphenylene ether, a mixture of a polyphenylene ether and a polystyrene or a polyphenylene ether-styrene graft copolymer,(B) 90-30 parts by weight of a mixture of (i) a thermoplastic aromatic copolyamide and/or an aromatic nuclear-hydrogenated copolyamide in an amount of 0.1-70% by weight of existing total polyamide and (ii) a thermoplastic aliphatic polyamide in a complementary amount of 99.9-30% by weight of existing total polyamide, and(C) 0.01-30 parts by weight, based on 100 parts by weight of the above components (A) and (B) of, at least one compound selected from the group consisting of oxazoline and a compound having, in its molecule, (a) carbon-carbon double bond or a carbon-carbon triple bond and (b) at least one functional group selected from carboxyl group, acid anhydride group, amino group, acid amide group, imido group, epoxy group, carboxylate ester group, isocyanate group, methylol group, oxazolidine group and hydroxyl group.
    Type: Grant
    Filed: March 3, 1989
    Date of Patent: December 17, 1991
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takashi Sanada, Kaoru Kitadono, Yasurou Suzuki, Taichi Nishio, Hiroomi Abe, Noriyasu Kagawa
  • Patent number: 4468412
    Abstract: A process for applying a light- or radiation-curable resin composition onto a polyolefin molding comprising surface treating a molding of polyolefin composition composed of 99.99 to 0 wt % of a polyolefin and 0.01 to 100 wt % of an olefinic polymeric compound having polar groups represented by the formula, --OCOR, ##STR1## wherein R and R' are each a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, by at least one pretreatment method selected from the group consisting of a treatment with a halogenated hydrocarbon solvent, a low temperature plasma treatment, a corona discharge treatment, a flame treatment and an alkali degreasing treatment, and applying onto the thus treated molding surface a light- or radiation-curable resin composition, is disclosed.
    Type: Grant
    Filed: August 18, 1983
    Date of Patent: August 28, 1984
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yoshikazu Fujii, Tomizou Kondo, Hideo Shinonaga, Kaoru Kitadono
  • Patent number: 3950278
    Abstract: A process for producing a crosslinked foam having uniform, fine, open cells, which comprises foaming an expandable composition comprising a crosslinkable polyolefin resin, 20 to 60 % by weight of an amorphous propylene polymer, a foaming agent and a crosslinking agent, by a one-step heat-press method. According to said process, a crosslinked foam having an open cell percentage of 40% or more can be obtained by a one-step treatment.
    Type: Grant
    Filed: May 28, 1974
    Date of Patent: April 13, 1976
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Motomu Wada, Kaoru Kitadono, Akira Oishi