Patents by Inventor Kaoru Nakashima

Kaoru Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11986795
    Abstract: A process for treating a petroleum fraction and for efficiently absorbing an organic halogen compound from a fluid mixture of the organic halogen compound and an inorganic halogen compound derived from crude oil. Also disclosed is an improvement in absorption performance of a halogen-compound-absorbing material, thereby reducing the frequency with which the absorbing material is exchanged. The absorbing agent includes attapulgite (palygorskite) having high absorption performance with respect to organic halogen compounds. Also disclosed is an absorption column in which the aforementioned absorbing agent and a halogen-compound-absorbing agent, that includes zinc oxide, are disposed in series, thereby making it possible to raise the treatment performance with respect to a fluid that contains, in high concentrations, the organic halogen compound in addition to the inorganic halogen compound.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: May 21, 2024
    Assignees: CLARIANT CATALYSTS (JAPAN) K.K., ENEOS CORPORATION
    Inventors: Tadahito Nakashima, Hyun-Joong Kim, Kaoru Fujiwara
  • Patent number: 6388311
    Abstract: A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring. The semiconductor device comprises grooves formed on a semiconductor element mounting surface of the pad to surround the semiconductor element, plated portions formed on only a ground bond area of the semiconductor element mounting surface of the pad, a thin portion formed on an entire peripheral edge portions on the back of the pad, and thin portions formed at portions which connect with the pad, on backs of support bars extending from the pad.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: May 14, 2002
    Assignee: Mitsui High-Tec Incorporated
    Inventors: Kaoru Nakashima, Chikaya Mimura, Seiichiro Sakata
  • Publication number: 20020050640
    Abstract: A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring.
    Type: Application
    Filed: December 6, 1999
    Publication date: May 2, 2002
    Inventors: KAORU NAKASHIMA, CHIKAYA MIMURA, SEIICHIRO SAKATA