Abstract: An imaging device includes a light source, a controller, and a camera. The camera generates a captured image by obtaining, in a first cycle, an image of infrared light. The camera also captures an image of infrared light (first light) transmitted through a windshield. The light source emits the infrared light in a second cycle. The second cycle for the emission is longer than the first cycle for the generation of the captured image. The controller generates a third image as a difference between a first image and a second image.

Abstract: An air conditioner control device includes: a receiver that receives measurement values for ambient temperatures of air conditioners installed inside a facility; and a controller that adjusts setting temperatures for cooling operations (or heating operations) of each of the air conditioners to values that are less (or values that are greater) than the measurement values for each of the air conditioners, when at least one of the measurement values received by the receiver is greater (or less) than a target temperature inside the facility.

Abstract: A cooling device includes: a heat receiver configured to transfer heat from a heat generation body to a refrigerant, a heat radiator that is connected to the heat receiver via a heat radiation path, and a return path that connects the heat radiator and the heat receiver with each other, in which the refrigerant is to circulate in order of the heat receiver, the heat radiation path, the heat radiator, and the return path and cause a gas-liquid two-phase change and cool the heat generation body, and in which the heat receiver includes a heat receiving plate which is in contact with the heat generation body and is configured to absorb the heat, and a heat receiving cover which covers a surface of the heat receiving plate and defines a heat receiving space.

Abstract: There is provided a cooling device including: a heat receiver (4) that transfers heat from a heat generation body to a refrigerant, a heat radiator that is connected to the heat receiver (4) via a heat radiation path (6), and a return path (7) that connects the heat radiator and the heat receiver (4) with each other, in which the refrigerant circulates in order of the heat receiver (4), the heat radiation path (6), the heat radiator, and the return path (7) while causing a gas-liquid two-phase change and cools the heat generation body, and in which the heat receiver (4) includes a heat receiving plate (11) which is in contact with the heat generation body and absorbs the heat, and a heat receiving cover (14) which covers a surface of the heat receiving plate (11) and forms a heat receiving space (13).

Abstract: An air conditioner control device includes: a receiver that receives measurement values for ambient temperatures of air conditioners installed inside a facility; and a controller that adjusts setting temperatures for cooling operations (or heating operations) of each of the air conditioners to values that are less (or values that are greater) than the measurement values for each of the air conditioners, when at least one of the measurement values received by the receiver is greater (or less) than a target temperature inside the facility.

Abstract: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

Abstract: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver, provided with a heat-generating body on an external wall, to transfer heat to an internal wall. The heatsink apparatus includes an inlet pipe supplying the working fluid to the heat receiver, an outlet pipe discharging vapor, into which the working fluid supplied to the heat receiver is evaporated by heat, and a heat dissipater dissipating heat of the vapor passing through the outlet pipe. An opening portion of the inlet pipe is opposite to and near the internal wall so as cause the working fluid near the internal wall to flow.

Abstract: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

Abstract: An inflow nozzle is disposed perpendicularly to plate-shaped fins of a heat-receiving section which is caused to face a heat-generating body to be cooled to draw heat therefrom, and portions of the plate-shaped fins are formed in a substantially V-shape or a substantially U-shape. Moreover, by selecting a proper dimension ratio of the thickness of a heat-receiving plate facing the heat-generating body and the length of the heat generating body, the heat absorption performance of the cooling device can be improved, and the cooling of the electronic component which generates high-temperature heat can be performed efficiently.