Patents by Inventor Kaoru Yasuda
Kaoru Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11947304Abstract: A cleaning device includes: a cleaning brush that has bristles that rotate and contact a surface, to which toner has adhered, of a cleaning member to be cleaned, the cleaning brush removing the toner adhered to the surface of the cleaning member; a first contact member that contacts the bristles without a position of the first contact member relative to a position of the cleaning brush being changed; and a second contact member that contacts the bristles at a location downstream from the first contact member in a direction of rotation of the cleaning brush and without a position of the second contact member relative to the position of the cleaning brush being changed, and that is disposed on an extension line extended from a line between an axial center of the cleaning brush and a base of the bristles that move away from the first contact member.Type: GrantFiled: September 20, 2022Date of Patent: April 2, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Haruyuki Ideura, Daisuke Tanaka, Takeshi Yasuda, Kaoru Matsushita
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Patent number: 11532162Abstract: A vehicle recognition unit of an information presenting device specifies a position of each of a plurality of vehicles, based on images captured by a plurality of imaging devices installed at a construction site. A vehicle designating unit receives designation of a designated vehicle, among the plurality of specified vehicles. A display control unit outputs a signal for displaying in an overlapping manner a proximity plot representing a position of another vehicle whose distance from the designated vehicle is less than a threshold on an overhead image of the construction site.Type: GrantFiled: February 19, 2019Date of Patent: December 20, 2022Assignee: Komatsu Ltd.Inventors: Masanobu Seki, Shunsuke Miyamoto, Kaoru Yasuda
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Publication number: 20220251268Abstract: A resin composition for injection molding or compression molding using an ethylene-based ionomer is excellent in impact strength, heat resistance, long-term durability, etc. The resin composition includes an ionomer in which, in a copolymer (P) containing a structural unit (A) derived from ethylene and/or an ?-olefin having 3 to 20 carbon atoms, and a structural unit (B) derived from a monomer having a carboxyl group(s) and/or a dicarboxylic anhydride group(s) as essential constitutional units, at least a part of the carboxyl groups and/or the dicarboxylic anhydride groups in the copolymer (P) being converted into a metal-containing carboxylic acid salt(s) containing at least one kind of a metal ion(s) selected from Group 1, Group 2 or Group 12 of the periodic table, and has a phase angle S at an absolute value G*=0.1 MPa of a complex modulus of elasticity measured by a rotary rheometer of 50 degrees to 75 degrees.Type: ApplicationFiled: June 24, 2020Publication date: August 11, 2022Applicant: JAPAN POLYETHYLENE CORPORATIONInventors: Keiichi YOSHIMOTO, Masahiro UEMATSU, Kaoru YASUDA
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Publication number: 20210150900Abstract: An information presenting device predicts a travel route of a first manned driving vehicle and outputs a signal for displaying the travel route of the first manned driving vehicle to a display device mounted on a second manned driving vehicle.Type: ApplicationFiled: February 12, 2019Publication date: May 20, 2021Inventors: Masanobu Seki, Shunsuke Miyamoto, Kaoru Yasuda
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Patent number: 10903129Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: GrantFiled: May 23, 2019Date of Patent: January 26, 2021Assignee: ROHM CO., LTDInventors: Motoharu Haga, Kaoru Yasuda, Akinori Nii, Yuto Nishiyama
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Publication number: 20200327336Abstract: A vehicle recognition unit of an information presenting device specifies a position of each of a plurality of vehicles, based on images captured by a plurality of imaging devices installed at a construction site. A vehicle designating unit receives designation of a designated vehicle, among the plurality of specified vehicles. A display control unit outputs a signal for displaying in an overlapping manner a proximity plot representing a position of another vehicle whose distance from the designated vehicle is less than a threshold on an overhead image of the construction site.Type: ApplicationFiled: February 19, 2019Publication date: October 15, 2020Applicant: Komatsu Ltd.Inventors: Masanobu Seki, Shunsuke Miyamoto, Kaoru Yasuda
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Patent number: 10566305Abstract: A semiconductor device includes a semiconductor element having first and second main surfaces spaced apart in a thickness direction. The semiconductor element includes a metal underlying layer on the first main surface, a bonding pad on the metal underlying layer with a wire bonded to the pad, and an insulative protection layer formed on the first main surface and surrounding the bonding pad. The bonding pad includes first and second conductive layers. The first conductive layer covers the metal underlying layer and is made of a metal having a lower ionization tendency than the metal underlying layer. The second conductive layer covers the first conductive layer and is made of a metal having a lower ionization tendency than the first conductive layer. The first and second conductive layers have respective peripheries held in close contact with the protection layer and covering a part of the protection layer.Type: GrantFiled: March 13, 2019Date of Patent: February 18, 2020Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda
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Patent number: 10435868Abstract: A control system for a work vehicle includes a display and a control unit which has the display show a perspective image in which at least a part of a work implement of a wheel loader or a vessel of a loaded vehicle is seen through.Type: GrantFiled: August 12, 2016Date of Patent: October 8, 2019Assignee: KOMATSU LTD.Inventors: Hideki Tsuji, Kaoru Yasuda, Norifumi Nishizaka
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Publication number: 20190279915Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: ApplicationFiled: May 23, 2019Publication date: September 12, 2019Inventors: Motoharu HAGA, Kaoru YASUDA, Akinori NII, Yuto NISHIYAMA
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Publication number: 20190214361Abstract: A semiconductor device includes a semiconductor element having first and second main surfaces spaced apart in a thickness direction. The semiconductor element includes a metal underlying layer on the first main surface, a bonding pad on the metal underlying layer with a wire bonded to the pad, and an insulative protection layer formed on the first main surface and surrounding the bonding pad. The bonding pad includes first and second conductive layers. The first conductive layer covers the metal underlying layer and is made of a metal having a lower ionization tendency than the metal underlying layer. The second conductive layer covers the first conductive layer and is made of a metal having a lower ionization tendency than the first conductive layer. The first and second conductive layers have respective peripheries held in close contact with the protection layer and covering a part of the protection layer.Type: ApplicationFiled: March 13, 2019Publication date: July 11, 2019Inventors: Motoharu HAGA, Kaoru YASUDA
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Patent number: 10332815Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: GrantFiled: June 1, 2017Date of Patent: June 25, 2019Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda, Akinori Nii, Yuto Nishiyama
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Patent number: 10269754Abstract: A semiconductor device includes a semiconductor element having first and second main surfaces spaced apart in a thickness direction. The semiconductor element includes a metal underlying layer on the first main surface, a bonding pad on the metal underlying layer with a wire bonded to the pad, and an insulative protection layer formed on the first main surface and surrounding the bonding pad. The bonding pad includes first and second conductive layers. The first conductive layer covers the metal underlying layer and is made of a metal having a lower ionization tendency than the metal underlying layer. The second conductive layer covers the first conductive layer and is made of a metal having a lower ionization tendency than the first conductive layer. The first and second conductive layers have respective peripheries held in close contact with the protection layer and covering a part of the protection layer.Type: GrantFiled: December 1, 2016Date of Patent: April 23, 2019Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda
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Publication number: 20190077195Abstract: The present invention provides a pneumatic tire by which workability when molding a tire and tire durability performance can be enhanced without increasing tire weight when providing a reinforcing layer formed by aligning a plurality of monofilament steel wires and embedding this plurality of monofilament steel wires in rubber. The pneumatic tire of the present invention includes a reinforcing layer formed by aligning a plurality of monofilament steel wires and embedding said monofilament steel wires in rubber. Each of the monofilament steel wires is provided with twisting around an axis thereof, and a wire surface twisting angle ? with respect to an axial direction of the monofilament steel wires is not less than 1°.Type: ApplicationFiled: November 9, 2018Publication date: March 14, 2019Inventors: Kaoru YASUDA, Yoshio UEDA
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Patent number: 10174483Abstract: A power transmission device of a work vehicle has an input shaft, an output shaft, a gear mechanism, and an electric motor. The gear mechanism has a planetary gear mechanism and transmits the rotation of the input shaft to the output shaft. The electric motor is connected to a rotating element of the planetary gear mechanism. The power transmission device is configured to change the rotation speed ratio of the output shaft with respect to the input shaft by changing the rotation speed of the electric motor. A control unit has a target torque determination unit and a target torque correcting unit. The target torque determination unit determines a target torque of the electric motor. The target torque correcting unit corrects the target torque according to a correction torque based on a moment of inertia of the electric motor.Type: GrantFiled: December 10, 2014Date of Patent: January 8, 2019Assignee: KOMATSU LTD.Inventors: Shunsuke Miyamoto, Kenichi Yamada, Kaoru Yasuda
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Patent number: 10068871Abstract: A semiconductor device includes a semiconductor substrate with a wiring layer formed thereon, an insulating film formed on the semiconductor substrate so as to cover the wiring layer and having a pad opening exposing a portion of the wiring layer as a pad, a front surface protection film formed on the insulating film and being constituted of an insulating material differing from the insulating film and having a second pad opening securing exposure of at least a portion of the pad, a seed layer formed on the pad, and a plating layer formed on the seed layer.Type: GrantFiled: April 5, 2017Date of Patent: September 4, 2018Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda
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Publication number: 20180171594Abstract: A control system for a work vehicle includes a display and a control unit which has the display show a perspective image in which at least a part of a work implement of a wheel loader or a vessel of a loaded vehicle is seen through.Type: ApplicationFiled: August 12, 2016Publication date: June 21, 2018Applicant: KOMATSU LTD.Inventors: Hideki TSUJI, Kaoru YASUDA, Norifumi NISHIZAKA
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Patent number: 9885168Abstract: A work vehicle includes a pump brake control determining unit determines that a pump brake control is to be executed for causing a braking force to be generated by using a load on a hydraulic pump during braking. A pump brake torque control unit increases a pump brake torque to correspond to the load on the hydraulic pump during the pump brake control.Type: GrantFiled: October 14, 2014Date of Patent: February 6, 2018Assignee: KOMATSU LTD.Inventors: Shunsuke Miyamoto, Yasuo Fujiwara, Kaoru Yasuda
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Publication number: 20170294400Abstract: A semiconductor device includes a semiconductor substrate with a wiring layer formed thereon, an insulating film formed on the semiconductor substrate so as to cover the wiring layer and having a pad opening exposing a portion of the wiring layer as a pad, a front surface protection film formed on the insulating film and being constituted of an insulating material differing from the insulating film and having a second pad opening securing exposure of at least a portion of the pad, a seed layer formed on the pad, and a plating layer formed on the seed layer.Type: ApplicationFiled: April 5, 2017Publication date: October 12, 2017Applicant: ROHM CO., LTD.Inventors: Motoharu HAGA, Kaoru YASUDA
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Publication number: 20170271225Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: ApplicationFiled: June 1, 2017Publication date: September 21, 2017Inventors: Motoharu HAGA, Kaoru YASUDA, Akinori NII, Yuto NISHIYAMA
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Patent number: 9698068Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: GrantFiled: July 8, 2015Date of Patent: July 4, 2017Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda, Akinori Nii, Yuto Nishiyama