Abstract: A package (10) for very large scale integrated circuit (VLSI) includes an electrically and thermally conductive tagboard (20) carrying the chip (12); supply terminals (15a) receiving a first supply potential; an interconnect structure (16) made of ceramic which surrounds the chip (12) and carries both the signal terminals (14) of the package (10) and the supply terminals (15b) receiving a second supply potential, the interconnect structure (16) incorporating the signal and supply conductors intended for the chip (12); and a decoupling device (17) including capacitors (19) and two conductor faces (18a, 18b) connected respectively to the supply terminals (15a, 15b). The decoupling by the capicitors (19) is thus done as close as possible to the conductor faces (18a and 18b) and as close as possible to the chip (12) at the level of islets (32a, 32b).

Abstract: A method for mounting an integrated circuit or chip (10) on a printed circuit board (11), the chip package (36) produced thereby, and a tape carrying chips for using the method are proposed. The chip is mounted by fixing its leads (12) on the zones (13) of the board (11) by securing the chip between a support board (15) and a heat dissipating element (14) that are connected with one another by conductive columns (16) to form the package (36). The invention is applicable in particular to manufacture of very large scale integration (VSLI) chips.

Abstract: An interconnecting substrate according to the invention comprises an insulating base on which rests a set of alternating, superimposed conductive and insulating layers. Contacts are formed on the uppermost insulating layer which border at least one site or zone intended for an integrated circuit chip device whose output conductors are to be connected to the said contacts. Through-connections enable the contacts to be coupled to one of the inner conductive layers. The through-connections include at least one through-connection on the inside of the site relative to at least a predetermined one of the said contacts. A shunt conductor means connected to the predetermined contact has a part outside the site which is connected to an additional contact which serves as a substitute or replaces the said predetermined contact for the connection to the associated output conductor of the chip device.

Abstract: A standardized access card is formed of a single or a pair of bonded sheets f material including a cavity within which is disposed an integrated circuit assembly for processing electrical signals arranged within the card. The thickness of the assembly is relatively smaller than the thickness of the card and terminal areas of the assembly are accessible through cut-outs in the card which may be open or plugged with conductive material. The card may be formed in a continuous process from a plurality of strips of material which separately provide the card material, the integrated circuit assembly and a cover for the device of the circuit assembly.

Abstract: A standardized access card is formed of a single or a pair of bonded sheets of material including a cavity within which is disposed an integrated circuit assembly for processing electrical signals arranged within the card. The thickness of the assembly is relatively smaller than the thickness of the card and terminal areas of the assembly are accessible through cut-outs in the card which may be open or plugged with conductive material. The card may be formed in a continuous process from a plurality of strips of material which separately provide the card material, the integrated circuit assembly and a cover for the device of the circuit assembly.

Abstract: A method of fabricating a carrier support for integrated circuit chips to be mounted subsequently on a substrate. A flexible strip of an inextensible insulating material is provided with equidistant openings in the center of each of which a chip is to be mounted. One of the faces of this strip is covered with a conductive film, the said film is cut away to form in each opening interface conductors which overhang towards the center of the opening. Before the conductive film is cut away, the film is coated with a layer of photosensitive lacquer which is partly removed to enable the film to be laid bare in regions which, in each opening, form part of an open-centered zone which surrounds that portion of the film in which the free inner ends of the interface conductors associated with this opening are to be produced.