Abstract: An integrated circuit package includes a ceramic substrate having a cut out configured to receive a flip chip. The cut out includes vias formed as through holes. A flip chip is received within the cut out of the ceramic substrate and has conductive bumps formed thereon corresponding to the electrical input/output contacts of the flip chip. The conductive bumps are received within the through holes of the ceramic substrate. A second integrated circuit chip is mounted on the flip chip in back-to-back relationship. A controlled impedance line is secured to the conductive bumps and acts as a coax. In another aspect of the present invention, a heat sink can be mounted on the back of the flip chip, and the second integrated circuit chip mounted on the heat sink.

Abstract: An integrated circuit package includes a substrate having a circuitry pattern formed on the substrate. A thermoplastic attachment film is positioned on the substrate and has vias that expose the circuitry pattern. A flip chip has input/output contacts formed as conductive bumps and mounted on the thermoplastic attachment film such that the conductive bumps are received within the cut openings and engage the circuitry pattern. The thermoplastic attachment film forms an underfill and a thermoplastic bond between the substrate and the flip chip, which allows ready removal of the flip chip upon application of heat. A method is also disclosed forming the integrated circuit package using the flip chip, thermoplastic attachment film and substrate of the present invention.

Abstract: An integrated circuit package includes a ceramic substrate having a cut out configured to receive a flip chip. The cut out includes vias formed as through holes. A flip chip is received within the cut out of the ceramic substrate and has conductive bumps formed thereon corresponding to the electrical input/output contacts of the flip chip. The conductive bumps are received within the through holes of the ceramic substrate. A second integrated circuit chip is mounted on the flip chip in back-to-back relationship. A controlled impedance line is secured to the conductive bumps and acts as a coax. In another aspect of the present invention, a heat sink can be mounted on the back of the flip chip, and the second integrated circuit chip mounted on the heat sink.

Abstract: An integrated circuit package includes a substrate having a circuitry pattern formed on the substrate. A thermoplastic attachment film is positioned on the substrate and has vias that expose the circuitry pattern. A flip chip has input/output contacts formed as conductive bumps and mounted on the thermoplastic attachment film such that the conductive bumps are received within the cut openings and engage the circuitry pattern. The thermoplastic attachment film forms an underfill and a thermoplastic bond between the substrate and the flip chip, which allows ready removal of the flip chip upon application of heat. A method is also disclosed forming the integrated circuit package using the flip chip, thermoplastic attachment film and substrate of the present invention.