Patents by Inventor Karey Holland
Karey Holland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9696372Abstract: Multiple planes within the sample are exposed from a single perspective for contact by an electrical probe. The sample can be milled at a non-orthogonal angle to expose different layers as sloped surfaces. The sloped edges of multiple, parallel conductor planes provide access to the multiple levels from above. The planes can be accessed, for example, for contacting with an electrical probe for applying or sensing a voltage. The level of an exposed layer to be contacted can be identified, for example, by counting down the exposed layers from the sample surface, since the non-orthogonal mill makes all layers visible from above. Alternatively, the sample can be milled orthogonally to the surface, and then tilted and/or rotated to provide access to multiple levels of the device. The milling is preferably performed away from the region of interest, to provide electrical access to the region while minimizing damage to the region.Type: GrantFiled: October 4, 2013Date of Patent: July 4, 2017Assignee: FEI CompanyInventors: Jeffrey Blackwood, Sang Hoon Lee, Michael Schmidt, Stacey Stone, Karey Holland
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Patent number: 9375823Abstract: CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.Type: GrantFiled: October 2, 2015Date of Patent: June 28, 2016Assignee: NexPlanar CorporationInventors: Robert Kerprich, Karey Holland, Diane Scott, Sudhanshu Misra
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Publication number: 20160023321Abstract: CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.Type: ApplicationFiled: October 2, 2015Publication date: January 28, 2016Inventors: Robert Kerprich, Karey Holland, Diane Scott, Sudhanshu Misra
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Patent number: 9180570Abstract: CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.Type: GrantFiled: March 16, 2009Date of Patent: November 10, 2015Assignee: NexPlanar CorporationInventors: Robert Kerprich, Karey Holland, Diane Scott, Sudhanshu Misra
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Publication number: 20150260784Abstract: Multiple planes within the sample are exposed from a single perspective for contact by an electrical probe. The sample can be milled at a non-orthogonal angle to expose different layers as sloped surfaces. The sloped edges of multiple, parallel conductor planes provide access to the multiple levels from above. The planes can be accessed, for example, for contacting with an electrical probe for applying or sensing a voltage. The level of an exposed layer to be contacted can be identified, for example, by counting down the exposed layers from the sample surface, since the non-orthogonal mill makes all layers visible from above. Alternatively, the sample can be milled orthogonally to the surface, and then tilted and/or rotated to provide access to multiple levels of the device. The milling is preferably performed away from the region of interest, to provide electrical access to the region while minimizing damage to the region.Type: ApplicationFiled: October 4, 2013Publication date: September 17, 2015Applicant: FEI CompanyInventors: Jeffrey Blackwood, Sang Hoon Lee, Michael Schmidt, Stacey Stone, Karey Holland
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Publication number: 20090311955Abstract: CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.Type: ApplicationFiled: March 16, 2009Publication date: December 17, 2009Applicant: NexPlanar CorporationInventors: Robert Kerprich, Karey Holland, Diane Scott, Sudhanshu Misra
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Patent number: 6261158Abstract: A multi-step CMP system is used to polish a wafer to form metal interconnects in a dielectric layer upon which barrier and metal layers have been formed. A first polish removes an upper portion of the metal layer using a first slurry and a first set of polishing parameters, leaving residual metal within the dielectric layer to serve as the metal interconnects. A second polish of the wafer on the same platen and polishing pad removes portions of the barrier layer using a second slurry under a second set of polishing parameters. The second polish clears the barrier layer from the upper surface of the dielectric layer, thereby forming the metal interconnect. To reduce dishing and dielectric erosion, the second slurry is selected so that the barrier layer is removed at a faster rate than the residual metal within the dielectric layer. A cleaning step may be optionally performed between the first and second polishes.Type: GrantFiled: December 16, 1998Date of Patent: July 17, 2001Assignee: SpeedFam-IPECInventors: Karey Holland, Ajoy Zutshi, Fen Dai, Yehiel Gotkis, C. Jerry Yang, Dennis Schey, Fred Mitchel, Lin Yang