Patents by Inventor Karin Tempelaars

Karin Tempelaars has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9656440
    Abstract: A method and system provide a releasable substrate on a carrier. The method includes providing the carrier with a bonding layer of radiation curable adhesive; selectively irradiating a first area subsection of the bonding layer with a first radiation for selectively at least partially curing the first area subsection; bringing a substrate in contact with the first area subsection and a second area subsection of the bonding layer; and curing the second area subsection in contact with the substrate for forming an adhesion area between the second area subsection and the substrate. The first area subsection forms a release area with an adhesion force between the bonding layer and the substrate lower in the release area than in the adhesion area as a result of the first area subsection being more cured than the second area subsection prior to being in contact with the substrate.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: May 23, 2017
    Assignee: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    Inventors: Martin K. P. van Neer, Karin Tempelaars, Linda B. van Leuken
  • Publication number: 20150231858
    Abstract: A method and system provide a releasable substrate on a carrier. The method includes providing the carrier with a bonding layer of radiation curable adhesive; selectively irradiating a first area subsection of the bonding layer with a first radiation for selectively at least partially curing the first area subsection; bringing a substrate in contact with the first area subsection and a second area subsection of the bonding layer; and curing the second area subsection in contact with the substrate for forming an adhesion area between the second area subsection and the substrate. The first area subsection forms a release area with an adhesion force between the bonding layer and the substrate lower in the release area than in the adhesion area as a result of the first area subsection being more cured than the second area subsection prior to being in contact with the substrate.
    Type: Application
    Filed: October 4, 2013
    Publication date: August 20, 2015
    Inventors: Martin K.P. van Neer, Karin Tempelaars, Linda B. van Leuken
  • Patent number: 8986445
    Abstract: The invention is directed to a construction material and to the use of modified layered inorganic material. The construction material of the invention comprises a layered inorganic material, which layered inorganic material comprises an ionic organic modifier compound and a biocide. The construction material of the invention has increased resistance against microbial fouling.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: March 24, 2015
    Assignee: Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
    Inventors: Jacobus Eversdijk, Karin Tempelaars, Rudolf Hartmut Fischer
  • Publication number: 20100313786
    Abstract: The invention is directed to a construction material and to the use of modified layered inorganic material. The construction material of the invention comprises a layered inorganic material, which layered inorganic material comprises an ionic organic modifier compound and a biocide. The construction material of the invention has increased resistance against microbial fouling.
    Type: Application
    Filed: June 4, 2010
    Publication date: December 16, 2010
    Applicant: Nederlandse Organisatie Toegepast- Natuurwetenschappelijk Onderzoek TNO
    Inventors: Jacobus Eversdijk, Karin Tempelaars, Rudolf Hartmut Fischer