Abstract: The protective housing (11) of the module IS placed in the manner of a cap on the outer edge (3) of a cooling body (1), on whose heat contact surface (5) facing the protective housing (11) lie the power components (9) or the circuit bearer (6) of a hybrid circuit (8). The protective housing (11) is made of plastic and has integrated clamp and lock areas (12, 13). The outer edge (3) of the cooling body (1) is fashioned so that by placing on of the protective housing (11) an annular positive and frictional connection can be produced between the protective housing (11) and the cooling body (1). The placing on simultaneously effects the surface pressure between the power components (9) and a heat contact surface (5) of the cooling body (1) by means of frictional connection elements (16, 17, 21) arranged between the power components (9) and the protective housing (11).

Abstract: A multi-pole, variable SMD terminal arrangement mountable on a circuit substrate has a stamped metallic element with at least three terminal poles connected with one another by means of a common connecting strip that can be removed after the soldering, the terminal poles having variably formed contact areas on the substrate side that are respectively deflected on one side from the plane of the connecting strip in basically z-shaped fashion, so that the contact areas deflected towards opposite sides form a support base for the terminal arrangement during assembly and soldering. The contact areas comprise end areas that form a contact plane that is coplanar to the substrate during assembly and soldering.

Abstract: A film integrated circuit includes at least one row of connection terminals to be connected in metallized holes of a given diameter formed in a printed circuit board. The connection terminals have a widened portion, one side with a pocket-like clamping contour to be connected to pads of a film IC, and another side to be connected to the printed circuit board and having a strip-like, comparatively narrower connection piece adjoining the widened portion. At least one of the connection pieces has a V-bend in a bending region forming a spring with one free arm and another arm being connected to the widened portion, for plug contacting in the holes formed in the printed circuit board. The V-bend has a bending radius being markedly smaller than the given diameter of a corresponding one of the holes formed in the printed circuit board. The bent connection pieces have a material thickness in the bending region being reduced by approximately 50%.

Abstract: A hybrid circuit unit having a film resistor on a circuit carrier and a ceramic stripe having an area of at least approximately the same size as the film resistor is secured in a highly thermally conductive way to at least one side of the plate-shaped circuit carrier.

Abstract: A metal plate is connected over a large area to one side of a glass or ceramic substrate for good heat distribution and removal. The metal plate consists of three layers, namely two outer copper layers and a center Invar layer having the thickness ratio of the layers of approximately 20:60:20. As a result of such a selected thickness ratio, the metal plate exhibits approximately the same coefficient of thermal expansion as the substrate and an inadmissible bending of the substrate or overstressing of the solder or adhesive line between the substrate and metal plate is prevented.