Abstract: The disclosure relates to an electrical switching contact, including a contact carrier and a contact plating, which has a contact material, and to a method for producing the electrical switching contact. The disclosure is characterized in that a layer that may be sintered is arranged between the contact material and the contact carrier in order to connect the contact material to the contact carrier.

Abstract: A simple method is provided for firmly-bonded connection of an electronic component to a substrate, which dispenses with the use of lead-containing paste solders and leads to a contact layer featuring sufficiently high resistance to heat fatigue in an environment characterized by incessant periodical temperature variations, and featuring high thermal and electrical conductivity.

Abstract: A power semiconductor module is disclosed including a housing for receiving at least one essentially board-type circuit carrier, the circuit carrier being provided with a metallization on at least one part of its surface and being populated with and electrically connected to at least one power semiconductor, rigid, integral and essentially straight load connection elements being applied on the metallized part of the metallized surface of the circuit carrier, which load connection elements are electrically and mechanically fixedly connected to the circuit carrier by one of their ends and project essentially perpendicularly into the housing interior, separate connection terminal elements for electrical conduct-making being placed onto the free end of the load connection elements.

Abstract: A power semiconductor module is disclosed including a housing for receiving at least one essentially board-type circuit carrier, the circuit carrier being provided with a metallization on at least one part of its surface and being populated with and electrically connected to at least one power semiconductor, rigid, integral and essentially straight load connection elements being applied on the metallized part of the metallized surface of the circuit carrier, which load connection elements are electrically and mechanically fixedly connected to the circuit carrier by one of their ends and project essentially perpendicularly into the housing interior, separate connection terminal elements for electrical conduct-making being placed onto the free end of the load connection elements.

Abstract: An incubation apparatus for microtiter plates includes an heating chamber and a incubation chamber. The heating chamber has a controllable hot air generator over which are arranged air guide devices for equalizing and distributing a stream of hot air to the microtiter plates. Air return devices are provided for collecting and returning hot air to the hot air generator. The heating chamber can be closed by a gate, and incubation chamber is divided by shelves into a plurality of compartments for receiving the microtiter plates. It is possible to close each compartment with a gate, and the side walls of the compartments are provided with heating devices. Furthermore, the incubation apparatus is provided with a gripping and transporting device having a working platform that is vertically displaceable and having a horizontally displaceable gripping arm.

Abstract: From the variables print hammer magnet voltage, print hammer magnet temperature, impact force, and a value derivable from the actual print time, a control voltage, which correspondingly delays an early trigger pulse by means of a variable delay element, is determined in an "open" control loop. The variables are analogously combined by adding, subtracting, and multiplying the analogue values, and by subsequently forming a weighted sum.

Abstract: The surface of a magnetic disk (23) is divided into servo sectors (S.sub.1) and data sectors (S.sub.2). A selectively positionable magnetic head (24) effects, in predetermined time intervals controlled by clock signals of a clock sensor (26), the transfer of servo and data signals. The servo signals sensed in the servo sectors are used for the track following control of the magnetic head.The servo markings (Ma) recorded in the servo sectors (S.sub.1) are arranged, with twice the width (2d) of the data tracks in radial distances of one respective track width (d), one beside the other in a row along a disk radius. In each servo sector at least three rows (A, B, C) of servo markings (Ma) are provided. The servo markings are arranged in track direction one behind the other in such a manner that between each of the rows (A, B, C) a distance (g) is formed, and that each servo marking of one row overlaps a servo marking of the following row by one track width (d).