Abstract: An image sensor comprising an image sensor layer having a plurality of image sensor layer contact pads; and a plurality of photo-sensitive elements, each being coupled to a respective image sensor layer contact pad; and a capacitor layer having: a plurality of first capacitor contact structures, each being constituted by a capacitor layer top contact pad bonded to a respective image sensor layer contact pad of the image sensor layer; a plurality of second capacitor contact structures; and a plurality of capacitors, embedded in a first dielectric material, each capacitor including at least one electrically conductive vertical nanostructure electrically conductively connected to one of a respective first capacitor contact structure and a respective second capacitor contact structure, and conductively separated from the other one of the respective first capacitor contact structure and the respective second capacitor contact structure by a layer of a second dielectric material.

Abstract: An electronic component package, comprising a package part comprising a plurality of contact pads on a first surface of the package part; a passive component having a first surface including contact pads bonded to a first set of contact pads in the plurality of contact pads and a second surface spaced apart from the first surface; a plurality of connecting structures for external electrical connection of the electronic component package; and an RDL stack interconnecting a second set of contact pads in the plurality of contact pads with the connecting structures for external electrical connection, the RDL stack comprising: a first conductor layer; a second conductor layer; and a dielectric layer arranged there between and comprising vias for conductively connecting the first conductor layer and the second conductor layer.

Abstract: A MIM energy storage device comprising a bottom electrode; a plurality of electrically conductive vertical nanostructures; a bottom conduction-controlling layer conformally coating each nanostructure in the plurality of electrically conductive vertical nanostructures; and a layered stack of alternating conduction-controlling layers and electrode layers conformally coating the bottom conduction-controlling layer, the layered stack including at least a first odd-numbered electrode layer at a bottom of the layered stack, a first odd-numbered conduction-controlling layer directly on the first odd-numbered electrode layer, and a first even-numbered electrode layer directly on the first odd-numbered conduction-controlling layer. Each even-numbered electrode layer in the layered stack is electrically conductively connected to the bottom electrode; and each odd-numbered electrode layer in the layered stack is electrically conductively connected to any other odd-numbered electrode layer in the layered stack.

Abstract: An ultrasonic transducer device for use in an acoustic biometric imaging system, the ultrasonic transducer device comprising: a first piezoelectric element having a first face, a second face opposite the first face, and side edges extending between the first face and the second face; a first transducer electrode on the first face of the first piezoelectric element; a second transducer electrode on the second face of the first piezoelectric element; and a spacer structure leaving at least a portion of the first transducer electrode of the first piezoelectric element uncovered.

Abstract: An electronic system comprising a substrate with a substrate conductor pattern including substrate pads; a semiconductor component with active circuitry, and component pads coupled to the active circuitry of the semiconductor component and connected to the substrate pads of the substrate; a power source interface for receiving power from a power source; and a power distribution network for distributing power from the power source interface to the active circuitry of the semiconductor component. The power distribution network includes a first capacitor realized by conductive structures comprised in the semiconductor component, the first capacitor being coupled to a first component pad and a second component pad of the semiconductor component; a second capacitor arranged between the substrate and the semiconductor component, the second capacitor being coupled to the first component pad and the second component pad of the component package; and a power grid portion of the substrate conductor pattern.

Abstract: Method for manufacturing a smartcard comprising a fingerprint sensor, the method comprising: arranging a fingerprint sensor module in an opening of a carrier layer of a smartcard body; forming a cavity in the smartcard in an area corresponding to a sensing area of the fingerprint sensor module; forming a plurality of surface structures in the cavity of the smartcard; depositing a liquid hydrophobic material in the cavity to at least partially cover the surface structures and a smartcard manufactured according to the described method.

Abstract: The present invention generally relates to a fingerprint sensor package comprising a substrate having thereon a plurality of electrical connection pads, a fingerprint sensor arranged on the substrate and electrically connected to at least one of the electrical connection pads, a bond wire loop formed from a bond wire having two ends of which at least one end is mechanically and electrically attached to a first one of the electrical connection pads, and a force sensing member in electrical contact with the first electrical connection pad via an upper portion of the bond wire loop, and in electrical contact with a second one of the electrical connection pads different from the first electrical connection pad, wherein an electrical property of the force sensing member is alterable in response to a deformation of the force sensing member.

Abstract: The invention relates to a method of a fingerprint sensing system of enabling cancelling out impairment data present in an image captured by a fingerprint sensor of the fingerprint sensing system, a method of a fingerprint sensing system of cancelling out impairment data present in an image captured by a fingerprint sensor of the fingerprint sensing system, and a fingerprint sensing system performing the methods.

Abstract: Method for manufacturing a smartcard comprising a fingerprint sensor, the method comprising: arranging a fingerprint sensor module in an opening of a carrier layer of a smartcard body; forming a cavity in the smartcard in an area corresponding to a sensing area of the fingerprint sensor module; forming a plurality of surface structures in the cavity of the smartcard; depositing a liquid hydrophobic material in the cavity to at least partially cover the surface structures and a smartcard manufactured according to the described method.

Abstract: An acoustic biometric imaging system comprising: a transparent device member having a first face to be touched by a finger surface of a user, and a second face opposite the first face, the transparent device member having a first acoustic impedance; a first ultrasonic transducer acoustically coupled to the second face of the transparent device member in a first transducer region for receiving acoustic signals conducted by the transparent device member from a finger touch region laterally spaced apart from the first transducer region, the first ultrasonic transducer having a second acoustic impedance; and an opaque masking layer arranged between the transparent device member and the first ultrasonic transducer in the first transducer region, the opaque masking layer having a third acoustic impedance between the first acoustic impedance and the second acoustic impedance.

Abstract: A method for manufacturing a fingerprint sensor device. The method comprises providing a fingerprint sensor chip, arranging the fingerprint sensor chip on a carrier, depositing a cover layer on the fingerprint sensor chip, the cover layer comprising a polarizable material; moving a top electrode into contact with a top surface of the cover layer; and applying a voltage between the top electrode and a bottom electrode located below the cover layer and comprised in a material stack between the bottom of the carrier and the cover layer, creating an electric field in the cover layer, thereby poling the cover layer such that a dielectric constant of the cover layer in a direction perpendicular to the sensing array is higher than a dielectric constant in a direction parallel to the sensing array, thereby forming a cover layer having an anisotropic dielectric constant.

Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.

Abstract: An ultrasonic transducer device for use in an acoustic biometric imaging system, the ultrasonic transducer device comprising: a first piezoelectric element having a first face, a second face opposite the first face, and side edges extending between the first face and the second face; a first transducer electrode on the first face of the first piezoelectric element; a second transducer electrode on the second face of the first piezoelectric element; and a spacer structure leaving at least a portion of the first transducer electrode of the first piezoelectric element uncovered.

Abstract: A method of manufacturing ultrasonic transducer devices, comprising fabricating an ultrasonic transducer panel; and dividing the ultrasonic transducer panel into ultrasonic transducer devices.

Abstract: A method for manufacturing a fingerprint sensor device. The method comprises providing a fingerprint sensor chip, arranging the fingerprint sensor chip on a carrier, depositing a cover layer on the fingerprint sensor chip, the cover layer comprising a polarizable material; moving a top electrode into contact with a top surface of the cover layer; and applying a voltage between the top electrode and a bottom electrode located below the cover layer and comprised in a material stack between the bottom of the carrier and the cover layer, creating an electric field in the cover layer, thereby poling the cover layer such that a dielectric constant of the cover layer in a direction perpendicular to the sensing array is higher than a dielectric constant in a direction parallel to the sensing array, thereby forming a cover layer having an anisotropic dielectric constant.

Abstract: The present invention generally relates to a fingerprint sensor package comprising a substrate having thereon a plurality of electrical connection pads, a fingerprint sensor arranged on the substrate and electrically connected to at least one of the electrical connection pads, a bond wire loop formed from a bond wire having two ends of which at least one end is mechanically and electrically attached to a first one of the electrical connection pads, and a force sensing member in electrical contact with the first electrical connection pad via an upper portion of the bond wire loop, and in electrical contact with a second one of the electrical connection pads different from the first electrical connection pad, wherein an electrical property of the force sensing member is alterable in response to a deformation of the force sensing member.

Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device. The fingerprint sensor device comprises a sensing array consisting of a plurality of sensing elements, the sensor device being configured to acquire an image of a finger placed on a sensing surface of the fingerprint sensor module. The fingerprint sensor module further comprises a substrate comprising an opening, wherein the fingerprint sensor device is arranged in the opening of the substrate and wherein the substrate comprises an antenna embedded in the substrate, the antenna being electrically connected to the fingerprint sensor device.

Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.

Abstract: The invention relates to a method of a fingerprint sensing system of enabling cancelling out impairment data present in an image captured by a fingerprint sensor of the fingerprint sensing system, a method of a fingerprint sensing system of cancelling out impairment data present in an image captured by a fingerprint sensor of the fingerprint sensing system, and a fingerprint sensing system performing the methods.

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements and comprising a plurality of cavities filled with a dielectric material. The dielectric material comprises reduced graphene oxide. Locations of the cavities correspond to locations of the sensing elements such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element. A dielectric constant of the dielectric material is higher than a dielectric constant of the coating material. The invention also relates to a sensing device where the dielectric coating layer containing reduced graphene oxide comprises trenches corresponding to areas between the sensing pixels filled with a fill material, where the dielectric coating layer has a higher dielectric constant than the fill material.