Abstract: In a machine tool, especially a punch, having a vertically movable upper tool carrier (1) with at least two punching tools (2) located next to each other and a lower tool carrier (3) with at least two punch matrixes (4) located next to each other, wherein preferably each punching tool (2) consists of a punch (5), a punch holder (6) and a retaining nut (7) connecting the punch (5) with the punch holder (6), and taking into consideration the cramped space in the upper tool carrier (1), a quick change of a punch (5) or of a punching tool (2) and/or of all punches (5) or punching tools (2) is possible, because the upper tool carrier (1) has a receiver plate (8) with a plurality of punch receivers (9) located next to each other and corresponding to the number of punching tools (2), because the punch receivers (9) are open in the direction of the front face of the upper tool carrier (1) and thereby the upper ends of the punching tools (2) or the punch holders (6) of the punching tools (2) are insertable or can be p

Abstract: An apparatus for working a elongated angle-iron workpiece having a pair of nonparallel flanges at least one of which is to be drilled has a transport unit for displacing the workpiece longitudinally through a working station and a support in the station for holding the workpiece with the one flange forming an acute angle with the horizontal. A drilling unit including a drilling tool can move horizontally in the station transverse to the workpiece and transverse to the workpiece and at the acute angle to the horizontal perpendicularly through the one flange. To obtain a given displacement along the workpiece flange, the carriage supporting the drill unit is moved horizontally through a horizontal distance equal to the desired displacement times the secant of the angle that the flange forms with the horizontal.

Abstract: An apparatus for removing solder bonded devices from a substrate which includes a hollow housing element having an open end with a seating portion adapted to engage the flat backside of a semiconductor device, an inlet for admitting heated gases to the interior of the housing, and an outlet for the heated gases, a baffle within the housing having an end portion recessed from the seating portion of the housing wherein the baffle directs heated gas downwardly against the backside of the device when in engagement with the seating portion of the housing, and a clamping means to secure a semiconductor device in seated relation on the seating portion.A rework method for removing a solder bonded semiconductor device from a ceramic substrate leaving only a coating of solder on the pad site sufficient to solder bond another device without the need for additional pad site preparation which includes the steps of preheating the substrate and solder bonded devices to a temperature not greater than 100.degree. C.

Abstract: A workpiece such as a steel profile to be perforated at predetermined distances from a longitudinal reference surface thereof is moved past a plurality of perforating tools, such as punching or drill presses, mounted on a main slide and associated with respective sensors carried on an ancillary slide, the two slides being provided with a rack-and-pinion coupling working into a position detector. Each sensor comprises two sensing heads movable, upon selective activation prior to operation of the corresponding tool, transversely to the workpiece path with a slight relative offset; the ancillary slide is displaced until the reference surface is detected by one--but not both--sensing heads whereupon a corrective motion is imparted to the main slide under the control of the position detector.

Abstract: A puncher-riveter has a fixed lower part having an upper surface and a vertically displaceable upper part above the lower part and having a lower surface. A hydraulic motor vertically displaces the upper part toward and away from the lower part. A punch having a lower punch end is vertically displaceable on the upper part between an upper rest position with the lower end above the lower surface of the upper part and a lower working position with the lower end below this lower surface. A die is provided on the lower part in vertical alignment with the punch so that the lower punch end can engage in the die when the punch is in the lower working position and the upper part is displaced down toward the lower part.

Abstract: An individual chip joining machine is designed primarily to bond a single chip to a multi-chip substrate. The machine includes an X-Y table for moving a substrate to locate a chip site beneath a probe. The probe serves to pick up a chip and either place it on the substrate or remove it therefrom and further serves to heat the chip to join it to the substrate by solder reflow or to melt the solder and allow the chip to be removed. The probe is mounted on a Z direction placement mechanism that also includes means to allow the probe to be backed off a fixed distance from a chip, once the chip has been placed on the substrate preparatory to joining thereto. A second heater heats the substrate to a bias temperature, this heating being controlled through use of a surrogate substrate having a thermocouple attached thereto.