Abstract: A method of selectively assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. A plurality of different mounting hardware for a PCB are provided for enabling the selective enhancement of the thermal characteristics of the module. One embodiment provides a conversion kit comprising a PCB having a circuit mounted thereon, lead frames, a baseplate, and open frame and baseplate mounting hardware that, when selectively attached to the PCB, result in an open frame or a baseplate module. The manufacturer of power conversion or other modules can thus manufacture and pretest the board's electronics before assembly into either an open frame or baseplate module, while also providing a conversion kit that includes inexpensive mounting hardware to enable a user to select between assembling a module as either an open frame or a baseplate module.

Abstract: An undershoot eliminator circuit is disclosed that avoids the occurrence of a negative undershoot that typically happens when an isolated DC-DC converter with a secondary side synchronous driver that is turned off. The undershoot eliminator circuit functions to discharge an energy storage element in an auxiliary supply on said secondary side of said converter.

Abstract: The present invention provides a terminal pin for connecting a DC—DC power converter module or the like to a PCB. The pin has improved current carrying capabilities by having a diameter over most of its length that is larger than the ends that are connected to either the module or PCB. The larger diameter also provides for improved heat flow from the power converter module to the PCB. A smaller diameter portion near the PCB board provides for improved flow of solder between the pin and the PCB. A stand-off member is also provided to maintain the module and PCB at a predetermined stand-off distance.

Abstract: The present invention provides a method of assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. In particular, the invention provides a plurality of different mounting fixtures for a PCB for enabling the selective enhancement of the thermal characteristics of the module. One embodiment of the invention provides a module comprising a PCB having a circuit mounted thereon and fixtures that, when attached to the PCB, result in an open frame or a baseplate module. A preferred circuit for said inventive assembly is a power conversion module designed to be mounted on another PCB that requires such power conversion in close proximity to the circuit components on the other board.

Abstract: The present invention provides a terminal pin for connecting a DC-DC power converter module or the like to a PCB. The pin has improved current carrying capabilities by having a diameter over most of its length that is larger than the ends that are connected to either the module or PCB. The larger diameter also provides for improved heat flow from the power converter module to the PCB. A smaller diameter portion near the PCB board provides for improved flow of solder between the pin and the PCB. A stand-off member is also provided to maintain the module and PCB at a predetermined stand-off distance.

Abstract: A resonant reset forward converter including a gate drive mechanism for controlling the conduction periods of a free-wheeling rectifier on the secondary side of the converter is disclosed. The gate drive mechanism is operative to turn on the free-wheeling rectifier at the beginning of the forward power cycle, maintain the free-wheeling rectifier in the on state during the transformer core reset and dead periods, and provide for rapid discharging of the freewheeling rectifier at the beginning of a subsequent forward power cycle.