Abstract: A device and method for controlling a voltage applied to processor cores of a processor are disclosed. The method includes processing a plurality of tasks on the processor with a plurality of processor cores and applying a rail voltage to the plurality of processor cores. The number of the plurality of processor cores that are active is adjusted, and the rail voltage that is applied to the plurality of processor cores is adjusted based upon the number of the plurality of processor cores that are active.

Abstract: A method and apparatus for testing electronic devices installed in a portable device. The apparatus incorporates a socket with receptacles for alignment pins, and an alignment plate with openings for the alignment pins. The holes for the alignment pins are matched to the socket receptacles, providing secure alignment. The spring loaded socket pin mates with at least one solder ball. The apparatus also includes a circuit card, which may be a modem test platform circuit card that has contacts that mate with the at least one solder ball. Other functions may be tested using other circuit card assemblies. A method of testing includes: installing the electronic device to be tested into a socket assembly, aligning the electronic device to be tested into the socket assembly; installing the socket assembly into a test apparatus, and testing the device.

Abstract: A device and method for controlling a voltage applied to processor cores of a processor are disclosed. The method includes processing a plurality of tasks on the processor with a plurality of processor cores and applying a rail voltage to the plurality of processor cores. The number of the plurality of processor cores that are active is adjusted, and the rail voltage that is applied to the plurality of processor cores is adjusted based upon the number of the plurality of processor cores that are active.

Abstract: A method and apparatus for high volume testing of logic devices with package-on-package (POP) memory. The apparatus includes a handler arm, compound nest attached to the handler arm, swing arm and a socketed assembly that facilitates alignment. In the method, a logic device is first installed in a compound nest. The compound nest is them attached to a handler arm. The compound nest is then aligned with a socketed assembly using a swing arm. Fine tuning of the alignment may be performed using guide pins and shoulder screws.