Abstract: Methods, systems, and devices for dirty write on power off are described. In an example, the described techniques may include writing memory cells of a device according to one or more parameters (e.g., reset current amplitude), where each memory cell is associated with a storage element storing a value based on a material property associated with the storage element. Additionally, the described techniques may include identifying, after writing the memory cells, an indication of power down for the device and refreshing, before the power down of the device, a portion of the memory cells based on identifying the indication of the power down for the device. In some cases, refreshing includes modifying at least one of the one or more parameters for a write operation for the portion of the memory cells.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first data line; a second data line adjacent the first data line and separated from the first data line by a first dielectric structure; and a memory cell formed over the first and second data lines. The memory cell includes a first transistor including a first channel region formed over and coupled to the first data line, and a charge storage structure separated from the first channel region; a second transistor including a second channel region formed over and coupled to the second data line, wherein the charge storage structure is formed over and coupled to the second channel region; and a second dielectric structure between the first channel region and each of the second channel region and the charge storage structure.

Abstract: Disclosed are techniques for correcting drift accumulation in memory cells. In some aspects, the techniques described herein relate to a memory device including: a memory array, the memory array including a set of memory cells; and a memory controller configured to read data from the memory array, the memory controller configured to: sense a first distribution of the set of memory cells, detect a missing cell in the first distribution, increase a voltage on the missing cell causing the missing cell to be read as part of the first distribution, detect that a second memory cell in a second distribution was read while sensing the first distribution, and mask the second memory cell and mark the second memory cell as belonging to the second distribution.

Abstract: Some embodiments include an integrated assembly having a first semiconductor material between two regions of a second semiconductor material. The second semiconductor material is a different composition than the first semiconductor material. Hydrogen is diffused within the first and second semiconductor materials. The conductivity of the second semiconductor material increases in response to the hydrogen diffused therein to thereby create a structure having the second semiconductor material as source/drain regions, and having the first semiconductor material as a channel region between the source/drain regions. A transistor gate is adjacent the channel region and is configured to induce an electric field within the channel region. Some embodiments include methods of forming integrated assemblies.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a data line, a memory cell coupled to the data line, a ground connection, and a conductive line. The memory cell includes a first transistor and a second transistor. The first transistor includes a first region electrically coupled to the data line, and a charge storage structure electrically separated from the first region. The second transistor includes a second region electrically coupled to the charge storage structure and the data line. The ground connection is coupled to the first region of the first transistor. The conductive line is electrically separated from the first and second regions and spans across part of the first region of the first transistor and part of the second region of the second transistor and forming a gate of the first and second transistors.

Abstract: Methods, systems, and devices for accessing a multi-level memory cell are described. The memory device may perform a read operation that includes pre-read portion and a read portion to access the multi-level memory cell. During the pre-read portion, the memory device may apply a plurality of voltages to a plurality of memory cells to identify a likely distribution of memory cells storing a first logic state. During the read portion, the memory device may apply a first read voltage to a memory cell based on performing the pre-read portion. The memory device may apply a second read voltage to the memory cell during the read portion that is based on the first read voltage. The memory device may determine the logic state stored by the memory cell based on applying the first read voltage and the second read voltage.

Abstract: A memory device can include multiple memory cells and a processing device operatively coupled with the memory device to perform operations including grouping the memory cells into a groups based on a metric reflecting an electrical distance of a memory cell from a voltage source, and determining, for each group, a respective share of write operations, wherein the share of write operations is related to an aggregate value of the metric for memory cells of the group. The operations can also include distributing the write operations to each group according to the share of write operations determined for the group.

Abstract: Some embodiments include apparatuses and methods using a substrate, a pillar having a length perpendicular to the substrate, a first conductive plate, a second conductive plate, a memory cell located between the first and second conductive plates and electrically separated from the first and second conductive plates, and a conductive connection. The first conductive plate is located in a first level of the apparatus and being separated from the pillar by a first dielectric located in the first level. The second conductive plate is located in a second level of the apparatus and being separated from the pillar by a second dielectric located in the second level. The memory cell includes a first semiconductor material located in a third level of the apparatus between the first and second levels and contacting the pillar and the conductive connection, and a second semiconductor material located in a fourth level of the apparatus between the first and second levels and contacting the pillar.

Abstract: Methods and systems include memory devices with a memory array comprising a plurality of memory cells. The memory devices include a control circuit operatively coupled to the memory array and configured to receive a read request for data and to apply a plurality of read voltages to the memory array based on the read request. The control circuit is further configured to perform a data analysis for a first set of data read based on the application of the plurality of read voltages and to derive a demarcation bias voltage (VDM) based on the data analysis. The control circuit is also configured to apply the VDM to the memory array to read a second set of data.

Abstract: Some embodiments include apparatuses and methods of operating such apparatuses. One of such apparatuses includes a data line, a conductive region, and a memory cell including a first transistor and a second transistor. The first transistor includes a first channel region coupled to the data line and the conductive region, a charge storage structure, and a first gate. The second transistor includes a second channel region coupled to the data line and the charge storage structure, and a second gate. The first gate is electrically separated from the second gate and opposite from the second gate in a direction from the first channel region to the second channel region.

Abstract: Some embodiments include an integrated assembly having a first semiconductor material between two regions of a second semiconductor material. The second semiconductor material is a different composition than the first semiconductor material. Hydrogen is diffused within the first and second semiconductor materials. The conductivity of the second semiconductor material increases in response to the hydrogen diffused therein to thereby create a structure having the second semiconductor material as source/drain regions, and having the first semiconductor material as a channel region between the source/drain regions. A transistor gate is adjacent the channel region and is configured to induce an electric field within the channel region. Some embodiments include methods of forming integrated assemblies.

Abstract: A microelectronic device comprises vertical inverter comprising a pillar structure vertically extending above a first conductive line. The pillar structure comprises a first vertical transistor vertically overlying and in electrical communication with the first conductive line, a second conductive line vertically overlying the first conductive line and electrically isolated from the first conductive line by a dielectric material, the second conductive line configured to be coupled to a ground structure, a second vertical transistor horizontally neighboring the first vertical transistor and in electrical communication with the second conductive line, the second vertical transistor horizontally spaced from the first vertical transistor by the dielectric material, and at least one electrode horizontally extending along a channel region of the first vertical transistor and an additional channel region of the second vertical transistor. Related microelectronic devices and electronic systems are also described.

Abstract: An inverter includes a transistor, an additional transistor overlying the transistor, and a hybrid gate electrode interposed between and shared by the transistor and the additional transistor. The hybrid gate electrode includes a region overlying a channel structure of the transistor, an additional region overlying the region and underlying an additional channel structure of the additional transistor, and further region interposed between the region and the additional region. The region has a first material composition. The additional region has a second material composition different than the first material composition of the region. Memory devices and electronic systems are also described.

Abstract: The present disclosure includes apparatuses, methods, and systems for multi-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of four possible data states by applying a first voltage pulse to the memory cell wherein the first voltage pulse has a first polarity and a first magnitude, and applying a second voltage pulse to the memory cell wherein the second voltage pulse has a second polarity and a second magnitude, and the second voltage pulse is applied for a shorter duration than the first voltage pulse.

Abstract: This document describes apparatuses and techniques for cache memory with randomized eviction. In various aspects, a cache memory randomly selects a cache line for eviction and/or replacement. The cache memory may also support multi-occupancy whereby the cache memory enters data reused from another cache line to replace the data of the randomly evicted cache line. By so doing, the cache memory may operate in a nondeterministic fashion, which may increase a probability of data remaining in the cache memory for subsequent requests.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a data line, a memory cell coupled to the data line, a ground connection, and a conductive line. The memory cell includes a first transistor and a second transistor. The first transistor includes a first region electrically coupled to the data line, and a charge storage structure electrically separated from the first region. The second transistor includes a second region electrically coupled to the charge storage structure and the data line. The ground connection is coupled to the first region of the first transistor. The conductive line is electrically separated from the first and second regions and spans across part of the first region of the first transistor and part of the second region of the second transistor and forming a gate of the first and second transistors.

Abstract: This document describes apparatuses and techniques for cache memory with randomized eviction. In various aspects, a cache memory randomly selects a cache line for eviction and/or replacement. The cache memory may also support multi-occupancy whereby the cache memory enters data reused from another cache line to replace the data of the randomly evicted cache line. By so doing, the cache memory may operate in a nondeterministic fashion, which may increase a probability of data remaining in the cache memory for subsequent requests.

Abstract: Some embodiments include apparatuses and methods of operating such apparatuses. One of such apparatuses includes a data line, a conductive region, and a memory cell including a first transistor and a second transistor. The first transistor includes a first channel region coupled to the data line and the conductive region, a charge storage structure, and a first gate. The second transistor includes a second channel region coupled to the data line and the charge storage structure, and a second gate. The first gate is electrically separated from the second gate and opposite from the second gate in a direction from the first channel region to the second channel region.

Abstract: Some embodiments include apparatuses in which one of such apparatus includes a first memory cell including a first transistor having a first channel region coupled between a data line and a conductive region, and a first charge storage structure located between the first data line and the conductive region, and a second transistor having a second channel region coupled to and located between the first data line and the first charge storage structure; a second memory cell including a third transistor having a third channel region coupled between a second data line and the conductive region, and a second charge storage structure located between the second data line and the conductive region, and a fourth transistor having a fourth channel region coupled to and located between the second data line and the second charge storage structure; a conductive line forming a gate of each of the first, second, third, and fourth transistors; and a conductive structure located between the first and second charge storage stru

Abstract: An inverter includes a transistor, an additional transistor overlying the transistor, and a hybrid gate electrode interposed between and shared by the transistor and the additional transistor. The hybrid gate electrode includes a region overlying a channel structure of the transistor, an additional region overlying the region and underlying an additional channel structure of the additional transistor, and further region interposed between the region and the additional region. The region has a first material composition. The additional region has a second material composition different than the first material composition of the region. Memory devices and electronic systems are also described.