Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract: Conductors extend parallel to one another in a device in the microwave range. Each conductor includes a conductive layer, a layer of a dielectric material and a ground plane. The ground planes of the two conductors are separated in the device by a core made of a dielectric material. The various layers are arranged on one another in the desired order, and a cavity is arranged in the device, extending from that layer in the first conductor which is to be connected to the second conductor, at right angles to the main direction of this layer, up to and including the layer on which the conductive layer of the second conductor is to lie. A component including a stripline conductor is arranged in the cavity, the component being arranged so that electrical contact is brought about between the conductor of the component and that layer in the first conductor which is to be connected to the second conductor.