Patents by Inventor Katherine Nickel

Katherine Nickel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8253420
    Abstract: A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: August 28, 2012
    Assignee: Volterra Semiconductor Corporation
    Inventors: Charles Nickel, Katherine Nickel, legal representative, David Lidsky, Seth Kahn
  • Publication number: 20110133747
    Abstract: A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.
    Type: Application
    Filed: December 4, 2009
    Publication date: June 9, 2011
    Applicant: VOLTERRA SEMICONDUCTOR CORPORATION
    Inventors: Charles Nickel, Katherine Nickel, David Lidsky, Seth Kahn