Abstract: A field emission device (100) includes an electron emitter (115) and an emitter-enhancing electrode (117) having an enhanced-emission structure (131), which is disposed proximate to electron emitter (115). Enhanced-emission structure (131) is embodied by, for example, each of the following structures: a tapered portion (118) of emitter-enhancing electrode (117), an electron-emissive edge (135) that is generally parallel to an axis (136) of electron emitter (115), a combination of a conductive layer (137) and an electron-emissive layer (138) that is disposed proximate to an edge (133) of conductive layer (137), and an electron-emissive layer (146) having a thickness of less than about 500 angstroms.

Abstract: A method for operating a field emission device (100) having an electron emitter (115) includes the steps of providing an emitter-enhancing electrode (117) proximate to electron emitter (115), causing emitter-enhancing electrode (117) to emit electrons, and causing the electrons emitted by emitter-enhancing electrode (117) to be received by electron emitter (115). A method for fabricating a field emission device (100) includes the steps of forming a layer (126) of dielectric material, forming emitter-enhancing electrode (117) on layer (126) of dielectric material, forming an enhanced-emission structure (131) in emitter-enhancing electrode (117), removing a portion of layer (126) of dielectric material proximate to enhanced-emission structure (131) to form a well (114, 158), and forming electron emitter (115) within well (114, 158).