Abstract: The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.

Abstract: The present application is directed to an article comprising a dusty surface and a coating on the dusty surface comprising a coating polymer having a Tg less ?20° C. and a method of reducing dust. In some embodiments, the polymer has a Tg less than ?30° C., and in specific embodiments, the polymer has a Tg less than ?45° C. The dusty surface may be, for example, crushed stone, coal, iron ore, gravel, sand or other aggregates (e.g. a roofing granule,) or a soil surface. Generally, the coating polymer comprises a polyacrylate, polyurethane, synthetic and natural rubber, silicone and other organic polymers. In specific embodiments, the coating polymer comprises an acrylic emulsion polymer.

Abstract: The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.