Patents by Inventor Kathryn C. Rivera
Kathryn C. Rivera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11825592Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: GrantFiled: October 5, 2020Date of Patent: November 21, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Chenzhou Lian, Kathryn C. Rivera, Paul F. Bodenweber, Jon A. Casey
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Publication number: 20210022239Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: ApplicationFiled: October 5, 2020Publication date: January 21, 2021Inventors: Kamal K. SIKKA, Chenzhou LIAN, Kathryn C. RIVERA, Paul F. BODENWEBER, Jon A. CASEY
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Patent number: 10834808Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: GrantFiled: September 28, 2015Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka
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Patent number: 10283487Abstract: Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.Type: GrantFiled: November 30, 2017Date of Patent: May 7, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: Luke G. England, Kathryn C. Rivera
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Patent number: 10224262Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.Type: GrantFiled: May 12, 2017Date of Patent: March 5, 2019Assignee: GLOBALFOUNDRIES Inc.Inventors: Kathryn C. Rivera, Janak G. Patel, David Stone, Samantha Donovan
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Publication number: 20180331011Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.Type: ApplicationFiled: May 12, 2017Publication date: November 15, 2018Inventors: Kathryn C. Rivera, Janak G. Patel, David Stone, Samantha Donovan
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Publication number: 20180233488Abstract: Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.Type: ApplicationFiled: November 30, 2017Publication date: August 16, 2018Inventors: Luke G. England, Kathryn C. Rivera
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Patent number: 9865570Abstract: Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.Type: GrantFiled: February 14, 2017Date of Patent: January 9, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Luke G. England, Kathryn C. Rivera
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Patent number: 9401315Abstract: A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.Type: GrantFiled: March 26, 2015Date of Patent: July 26, 2016Assignee: GLOBALFOUNDRIES Inc.Inventors: Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Hilton T. Toy
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Publication number: 20160021731Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: ApplicationFiled: September 28, 2015Publication date: January 21, 2016Inventors: Paul F. BODENWEBER, Jon A. CASEY, Chenzhou LIAN, Kathryn C. RIVERA, Kamal K. SIKKA
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Patent number: 9226426Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: GrantFiled: July 18, 2012Date of Patent: December 29, 2015Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka
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Publication number: 20140024465Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: ApplicationFiled: July 18, 2012Publication date: January 23, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. BODENWEBER, Jon A. CASEY, Chenzhou LIAN, Kathryn C. RIVERA, Kamal K. SIKKA
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Patent number: 7928562Abstract: An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.Type: GrantFiled: July 22, 2008Date of Patent: April 19, 2011Assignee: International Business Machines CorporationInventors: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz
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Publication number: 20100019377Abstract: An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.Type: ApplicationFiled: July 22, 2008Publication date: January 28, 2010Applicant: International Business Machines CorporationInventors: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz
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Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
Patent number: 7567090Abstract: A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.Type: GrantFiled: October 23, 2006Date of Patent: July 28, 2009Assignee: International Business Machines CorporationInventors: Normand Cote, Peter J. Demko, David L. Gardell, Jeffrey D. Gelorme, Marc D. Knox, George J. Lawson, Kathryn C. Rivera -
Publication number: 20090098666Abstract: Methods of assembling a chip package are disclosed that employ heat from test pattern operation of the chip to cure a thermal interface material. The methods may also simultaneously verify thermal performance of the package using the heat from test pattern operation. Further, the heat may be used to cure the sealing material and/or underfill material, where they are used.Type: ApplicationFiled: October 11, 2007Publication date: April 16, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ronald L. Hering, Kathryn C. Rivera, Kamal K. Sikka
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Liquid Recovery, Collection Method And Apparatus In A Non-Recirculating Test And Burn-In Application
Publication number: 20080116921Abstract: A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.Type: ApplicationFiled: October 23, 2006Publication date: May 22, 2008Inventors: Normand Cote, Peter J. Demko, David L. Gardell, Jeffrey D. Gelorme, Marco D. Knox, George J. Lawson, Kathryn C. Rivera