Patents by Inventor Katsuhiko Yamamoto

Katsuhiko Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118223
    Abstract: A surface inspection device (1) according to the present invention comprises: a plate-shaped sample holding member (3) which can hold a sample (2); a spindle motor (4) for rotating the sample holding member (3); a turntable (5) which is fixed to the spindle motor (4) and rotated by the spindle motor (4); a frame (6) to which the spindle motor (4) is fixed; a plurality of support members (12) each having one end fixed to the sample holding member (3) and the other end fixed to the turntable (5), the support members supporting the sample holding member (3) such that the sample holding member is displaceable in a focus direction which is the height direction with respect to the turntable (5); and a sample drive unit (11) which displaces the sample holding member (3) in the focus direction with respect to the turntable (5). This surface inspection device (1) can accurately drive the sample (2) in the focus direction.
    Type: Application
    Filed: April 14, 2021
    Publication date: April 11, 2024
    Inventors: Katsuhiko KIMURA, Yoshihiro SATOU, Masaya YAMAMOTO, Ayumi TOMIYAMA
  • Publication number: 20240096655
    Abstract: There is provided a technique that includes: a process chamber in which a substrate is processed; an electromagnetic wave generator configured to supply an electromagnetic wave into the process chamber; and a gas supplier through which a cooling gas is supplied to the substrate by adjusting a direction of supplying the cooling gas.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 21, 2024
    Applicant: Kokusai Electric Corporation
    Inventor: Katsuhiko Yamamoto
  • Publication number: 20230307230
    Abstract: There is provided a technique that includes: loading a substrate in which a treatment target film and an action target film are formed into a process chamber; irradiating the action target film with an electromagnetic wave; and causing the action target film to generate heat by the irradiation with the electromagnetic wave and modifying the treatment target film with a directionality by heating the treatment target film with the heat generated by the action target film.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 28, 2023
    Applicant: Kokusai Electric Corporation
    Inventors: Takashi NAKAGAWA, Shinya SASAKI, Noriaki MICHITA, Katsuhiko YAMAMOTO
  • Publication number: 20230307267
    Abstract: According to the present disclosure, there is provided a technique capable of preventing a substrate from being warped or cracked due to a heat treatment process. According to one aspect thereof, there is provided a substrate processing apparatus including: a process chamber in which a plurality of substrates accommodated in a substrate retainer are processed; an electromagnetic wave generator configured to supply an electromagnetic wave into the process chamber; and a gas supplier configured to supply a cooling gas is supplied to between adjacent substrates among the plurality of substrates via a plurality of gas supply ports provided so as to correspond to an interval of the plurality of substrates accommodated in the substrate retainer.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 28, 2023
    Applicant: Kokusai Electric Corporation
    Inventors: Katsuhiko YAMAMOTO, Shuhei SAIDO, Takashi NAKAGAWA, Yoshihiko YANAGISAWA, Shinya SASAKI, Noriaki MICHITA
  • Publication number: 20230189407
    Abstract: There is provided a technique, which includes: a process chamber where a substrate is processed; a microwave oscillator configured to supply microwaves to the process chamber; and a controller configured to be capable of controlling the microwave oscillator to perform: a heating process where the substrate is heated with a first microwave, among the supplied microwaves, supplied at a first microwave power so that a process of supplying the first microwave during a supply time and a process of stopping the supply of the first microwave during a stop time shorter than the supply time are performed a predetermined number of times or for a first predetermined time; and a modifying process in which the substrate is supplied with a second microwave, among the supplied microwaves, at a second microwave power higher than the first microwave power for a second predetermined time while maintaining the second microwave power.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 15, 2023
    Applicant: Kokusai Electric Corporation
    Inventors: Katsuhiko YAMAMOTO, Keishin Yamazaki, Shinya Sasaki, Noriaki Michita
  • Publication number: 20230091762
    Abstract: There is provided is a technique includes: at least one processing chamber in which a substrate is processed; a processing gas supplier that supplies a processing gas to the at least one processing chamber; a transfer chamber communicable with the at least one processing chamber; a first inert gas supplier that supplies an inert gas to the transfer chamber; a first exhauster that discharges an atmosphere from the transfer chamber; and a second inert gas supplier that supplies the inert gas discharged by the first exhauster to the at least one processing chamber or a downstream portion of the at least one processing chamber.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 23, 2023
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventor: Katsuhiko YAMAMOTO
  • Publication number: 20220384206
    Abstract: There is provided a technique that include: a process chamber configured to process a substrate at which at least one target film and a heat assist film are formed; and an electromagnetic wave generator configured to supply an electromagnetic wave into the process chamber, wherein when the substrate is irradiated with the electromagnetic wave, the heat assist film generates heat and the at least one target film is modified by the heat.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 1, 2022
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya Sasaki, Noriaki Michita, Katsuhiko Yamamoto, Takashi Nakagawa, Kazuhiro Yuasa
  • Patent number: 11501775
    Abstract: A voice signal control device includes a processor having hardware configured to process a voice signal generated by a voice signal generation device configured to generate the voice signal according to setting information of a voice output in a voice processing device configured to output the voice signal, and make the voice processing device output voice according to the voice signal after the processing.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: November 15, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Katsuhiko Yamamoto
  • Patent number: 11462228
    Abstract: A speech intelligibility calculating method is a method executed by a speech intelligibility calculating apparatus, the speech intelligibility calculating method including: a speech intelligibility calculating step of calculating a speech intelligibility that is an objective assessment index of a speech quality, based on a difference component between features found through an analysis of an input clean speech and an input enhanced speech, using one or more filter banks; and a step of outputting the speech intelligibility calculated at the speech intelligibility calculating step. This speech intelligibility calculating method is capable of calculating a speech intelligibility without any dependency on a speech enhancement method.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: October 4, 2022
    Assignees: NIPPON TELEGRAPH AND TELEPHONE CORPORATION, WAKAYAMA UNIVERSITY
    Inventors: Shoko Araki, Tomohiro Nakatani, Keisuke Kinoshita, Toshio Irino, Toshie Matsui, Katsuhiko Yamamoto
  • Publication number: 20220301850
    Abstract: There is provided a technique capable of cleaning a film deposited on an outer peripheral portion of a substrate placing surface of a substrate support. According to one aspect thereof, a substrate processing apparatus includes: a process chamber where a product substrate is processed; a substrate support provided in the process chamber and provided with a substrate placing surface whereon the product substrate is placed; a process gas supplier wherethrough a process gas is supplied into the process chamber while the product substrate being placed on the substrate placing surface; and a cleaning gas supplier wherethrough a cleaning gas is supplied into the process chamber while a dummy substrate being placed on the substrate placing surface. An outer peripheral portion of the dummy substrate is out of contact with the substrate placing surface in a state where the dummy substrate is placed on the substrate placing surface.
    Type: Application
    Filed: February 24, 2022
    Publication date: September 22, 2022
    Inventors: Koei KURIBAYASHI, Tatsushi UEDA, Katsuhiko YAMAMOTO
  • Publication number: 20210375300
    Abstract: A speech intelligibility calculating method is a method executed by a speech intelligibility calculating apparatus, the speech intelligibility calculating method including: a speech intelligibility calculating step of calculating a speech intelligibility that is an objective assessment index of a speech quality, based on a difference component between features found through an analysis of an input clean speech and an input enhanced speech, using one or more filter banks; and a step of outputting the speech intelligibility calculated at the speech intelligibility calculating step. This speech intelligibility calculating method is capable of calculating a speech intelligibility without any dependency on a speech enhancement method.
    Type: Application
    Filed: August 3, 2018
    Publication date: December 2, 2021
    Applicants: NIPPON TELEGRAPH AND TELEPHONE CORPORATION, Wakayama University
    Inventors: Shoko ARAKI, Tomohiro NAKATANI, Keisuke KINOSHITA, Toshio IRINO, Toshie MATSUI, Katsuhiko YAMAMOTO
  • Patent number: 11168396
    Abstract: There is provided a technique that includes a first act of modifying a film containing a silazane bond by heating a substrate, in which the film containing the silazane bond is formed over a surface of the substrate, to a first temperature and by supplying a first processing gas containing hydrogen peroxide to the substrate; and after the first act, a second act of modifying the film containing the silazane bond by heating the substrate to a second temperature higher than the first temperature and by supplying a second processing gas containing hydrogen peroxide to the substrate.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 9, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Toru Kakuda, Masahisa Okuno, Katsuhiko Yamamoto, Takuya Joda, Sadayoshi Horii
  • Publication number: 20210233526
    Abstract: A voice signal control device includes a processor having hardware configured to process a voice signal generated by a voice signal generation device configured to generate the voice signal according to setting information of a voice output in a voice processing device configured to output the voice signal, and make the voice processing device output voice according to the voice signal after the processing.
    Type: Application
    Filed: November 16, 2020
    Publication date: July 29, 2021
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventor: Katsuhiko Yamamoto
  • Patent number: 10985017
    Abstract: Described herein is a technique capable of improving a quality of a substrate processing performed using hydrogen peroxide. According to one aspect of the technique described herein, there is provided a method of manufacturing a semiconductor device including: (a) supplying a first process gas containing water and a first concentration of hydrogen peroxide to a substrate having a silicon-containing film formed on a surface thereof; and (b) supplying a second process gas containing water and a second concentration of hydrogen peroxide higher than the first concentration to the substrate after (a).
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: April 20, 2021
    Assignee: Kokusai Electric Corporation
    Inventors: Katsuhiko Yamamoto, Takuya Joda, Toru Kakuda, Sadayoshi Horii
  • Publication number: 20200002816
    Abstract: There is provided a technique that includes a first act of modifying a film containing a silazane bond by heating a substrate, in which the film containing the silazane bond is formed over a surface of the substrate, to a first temperature and by supplying a first processing gas containing hydrogen peroxide to the substrate; and after the first act, a second act of modifying the film containing the silazane bond by heating the substrate to a second temperature higher than the first temperature and by supplying a second processing gas containing hydrogen peroxide to the substrate.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Toru KAKUDA, Masahisa OKUNO, Katsuhiko YAMAMOTO, Takuya JODA, Sadayoshi HORII
  • Publication number: 20190304778
    Abstract: Described herein is a technique capable of improving a quality of a substrate processing performed using hydrogen peroxide. According to one aspect of the technique described herein, there is provided a method of manufacturing a semiconductor device including: (a) supplying a first process gas containing water and a first concentration of hydrogen peroxide to a substrate having a silicon-containing film formed on a surface thereof; and (b) supplying a second process gas containing water and a second concentration of hydrogen peroxide higher than the first concentration to the substrate after (a).
    Type: Application
    Filed: February 26, 2019
    Publication date: October 3, 2019
    Inventors: Katsuhiko YAMAMOTO, Takuya JODA, Toru KAKUDA, Sadayoshi HORII
  • Patent number: 10226426
    Abstract: The present invention provides a method of producing a suspension containing a nano-cocrystal having an average particle size of not more than 300 nm, a polymer having a number average molecular weight of not less than 3,000, a surfactant having a number average molecular weight of less than 3,000 and water, which method including wet grinding a cocrystal, which is constituted of an organic compound and a cocrystal former and is not dissociated by wet grinding, in water containing the polymer and the surfactant.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: March 12, 2019
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Masatoshi Karashima, Katsuhiko Yamamoto, Takashi Kojima, Yukihiro Ikeda
  • Patent number: 10032630
    Abstract: There is provided a technique for facilitating a patterning process by the DSA appropriately and efficiently. According to the technique described herein, there is provided a method of manufacturing a semiconductor device, including (a) accommodating in a process chamber a substrate having a guide pattern thereon; (b) supplying a plasma of a first process gas into the process chamber to subject the substrate to first one of a first process for hydrophilizing the substrate and a second process for hydrophobilizing the substrate; and (c) supplying a plasma of a second process gas into the process chamber to subject the substrate to second one of the first process and the second process other than the first one of the first process and the second process.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: July 24, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Katsuhiko Yamamoto, Hajime Karasawa, Kazuyuki Toyoda
  • Patent number: 9966261
    Abstract: Described herein is a technique capable of improving the uniformity of device characteristics. A method of manufacturing a semiconductor device may include: (a) accommodating in a process chamber a substrate having an organic film thereon; (b) supplying a metal-containing gas to the substrate; (c) supplying a first oxygen-containing gas and a dilute gas to the substrate, the dilute gas containing at least one of a second oxygen-containing gas and an inert gas; (d) performing a cycle a predetermined number of time, the cycle including (b) and (c), wherein a flow rate of the first oxygen-containing gas is equal to or greater than a flow rate of the dilute gas in one of the cycle performed the predetermined number of time.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: May 8, 2018
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Katsuhiko Yamamoto, Naofumi Ohashi
  • Publication number: 20180036244
    Abstract: The present invention provides a method of producing a suspension containing a nano-cocrystal having an average particle size of not more than 300 nm, a polymer having a number average molecular weight of not less than 3,000, a surfactant having a number average molecular weight of less than 3,000 and water, which method including wet grinding a cocrystal, which is constituted of an organic compound and a cocrystal former and is not dissociated by wet grinding, in water containing the polymer and the surfactant.
    Type: Application
    Filed: March 1, 2016
    Publication date: February 8, 2018
    Inventors: Masatoshi KARASHIMA, Katsuhiko YAMAMOTO, Takashi KOJIMA, Yukihiro IKEDA