Abstract: Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.

Abstract: Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.

Abstract: Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.

Abstract: Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.

Abstract: Object of the present invention is to provide a production method of a highly crystalline silver powder containing powder particles in fine particle region and having a good particle size distribution as well as the highly crystalline silver powder obtained by the production method. In order to achieve the object, the present invention adopts a production method characterized in that the method comprises preparation of a first aqueous solution in which gelatin, silver nitrate and nitric acid are dissolved in water, preparation of a second aqueous solution in which L-sorbic acid and/or ascorbic acid and a water-soluble organic acid are dissolved, adding of the second aqueous solution slowly to mix with the first aqueous solution, stirring of the mixture to grow the silver particles after finishing the mixing, keeping of the mixture still to settle the silver particles, discarding of the supernatant, filtration and rinsing to obtain the highly crystalline silver powder.

Abstract: Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained.

Abstract: An object of the present invention is to provide highly crystalline silver powder which is characterized in fine particles, showing high dispersibility, it's particle size distribution is not excessively sharp but relatively broad and crystallites are large; and a method for producing the same. In order to achieve the object, a method for producing highly crystalline silver powder is characterized in that mixing a first aqueous solution and a second aqueous solution, wherein the first aqueous solution contains silver nitrate, a dispersing agent and nitric acid, and the second solution contains ascorbic acid. For dispersing agent, polyvinylpyrrolidone or gelatin is preferred. Highly crystalline silver powder produced by the above-described method is preferred to be a crystallite diameter of 300 ? or more, an average particle diameter D50 in the range from 0.5 ?m to 10 ?m, and a thermal shrinkage rate for the length direction after heating at 700° C. in the range from ?3% to 3%.

Abstract: The present invention is directed at providing fine nickel particles with a sharp particle size distribution, and providing an electroconductive paste using the nickel particles. In order to obtain the nickel particles capable of achieving the purpose, a method for producing the nickel particle by elevating a temperature of the reactive solution containing a nickel salt and a polyol to a reduction temperature, and reducing the nickel salt in the reactive solution which is characterized in that the reactive solution is prepared to contain a carboxylic acid or an amine having a carboxyl functional group and/or an amino functional group, and a precious metal catalyst before the solution temperature is elevated to the reduction temperature. Nickel particles obtained with the production method have an average image analytical particle diameter of 1 nm to 300 nm.

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.

Abstract: An object of the present invention is to provide a silver powder which is an unprecedentedly fine particulate silver powder and has a dispersibility more approximate to monodispersibility resulting less aggregation. To achieve the above object, a fine particulate silver powder having unprecedented powder properties in which: a. the average particle diameter DIA of the primary particles obtained by image analysis of a scanning electron micrograph is 0.6 ?m or less; b. the crystallite diameter is 10 nm or less; and c. the sintering starting temperature is 240° C.

Abstract: Objects of the present invention are to provide oxidation resistant nickel-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit, and to provide a method for producing the same. In order to achieve the objects, there is provided nickel-coated copper powder which is characterized in that it comprises nickel-coated copper particles in which a core material is copper particles, a catalyst for plating is fixed to a surface of the copper-particles by reduction reaction and electroless plated nickel is applied to the outermost surface. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

Abstract: It is an object to provide a copper-containing tin powder having excellent capabilities in forming fine wiring circuits and filling via holes with ability in bond by melting at a low temperature. In order to achieve the object, it is produced from a copper powder as a starting material by a wet substitution process and it contains remainder of copper un-substituted at 30% by weight or less. The change rate of properties of the copper-containing tin powder, e.g. an average primary particle size or the like is in the range from ?20 to +5% with respect to the starting copper powders. The copper-containing tin powder is produced by a wet substitution process in which a copper powder is brought into contact with a plating solution for tin substitution to make copper component constituting the copper powder dissolve with simultaneous substituted deposition of tin.

Abstract: It is an object to provide a superfine copper powder slurry which enables finer-pitch wirings formation on the substrates when it is used for an electroconductive ink or an electroconductive paste for wirings. In order to achieve the object, a superfine copper powder slurry produced by suspending a superfine copper powder having powder characteristics of the value DTEM (micron meter) of 0.01 to 0.1, the ratio D50/DTEM of 1.0 to 1.5 and the ratio grain size/DTEM of 0.2 to 1 in a solvent, where (DTEM is) an average primary particle diameter of the powder particle diameter directly measured from observation image of TEM and calculated with observation magnification, and D50 is a particle diameter at 50% cumulative particle size examined by Doppler scattering photo analysis.

Abstract: An object of the present invention is to provide an electro conductive tin oxide powder which is free from toxic dopant, e.g., antimony, which can provide excellent conductivity to a polymer, and easy to disperse in a paint and the conductive film formed shows excellent transparency; and also provide the method for producing an electro conductive tin oxide powder. In order to achieve the above objects, the present invention disclose the electro conductive tin oxide powder which is characterized in that it is free from a dopant and the paint prepared with it gives conductive film which shows a Haze value of 5% or less and surface resistance of 1010?/ or less.

Abstract: It is an object of the present invention to provide a flaky copper powder composed of fine particles having a sharp distribution particle size, a large crystallite diameter and high oxidation resistance. The flaky copper powder of the present invention contains P and has a crystallite diameter/D1A ratio of 0.01 or more to achieve the object.

Abstract: The objects of the present invention are to provide silver compound-coated silver powder applicable to a conductive paste for forming conductive interconnections for an electronic circuit by the silver powder coated with a silver compound which is thermally decomposed at lower temperature than a melting point of silver, and also to provide a method for producing the same. The means for achieving the objects involves thermal decomposition of the silver compound which is decomposed at much lower temperature than a melting point of silver to fuse silver compound-coated silver particles to each other by silver from the silver compound during sintering of a substrate on which electronic circuit conductive interconnections are to be formed by the conductive paste which contains the silver compound-coated silver powder containing the silver compound-coated silver particles in which the silver particles are coated with the silver compound.

Abstract: An object of the present invention is to provide a silver powder which is an unprecedentedly fine particulate silver powder, has a dispersibility more approximate to monodispersibility resulting less aggregation, and has a low impurity content. To achieve the above object, a fine particulate silver powder having unprecedented powder properties in which: a. the average particle diameter DIA of the primary particles obtained by image analysis of a scanning electron micrograph is 0.6 ?m or less; b. the crystallite diameter is 10 nm or less; c. the sintering starting temperature is 240° C. or less; and d. the carbon content is 0.

Abstract: The present invention is mainly for providing a flake copper powder for a conductive paste with particle properties which are defined by that the particle thickness is thinner being possible for use to form an electrode or a circuit, and a production process thereof. To achieve the object of producing the following particles, each powder particles shape is plastically processed into a flake-shape, wherein the flake copper powder has a cumulative particle diameter D50 of 10 ?m or smaller measured with laser diffraction scattering particle size distribution method. The D10, D50 and D90 measured with the laser diffraction scattering particle size distribution method are illustrative and the SD/D50 value measured by the standard deviation of particle distribution with the laser diffraction scattering particle size distribution, is 0.55 or larger and/or a D90/D10 of 4.5 or smaller.

Abstract: This invention is a silver powder having a low-temperature sintering performance and dispersibility, which allows the powder particles to be agglomerated to a small degree and be nearly in the monodisperse state. Employed is silver powder of fine silver particles each to which fine silver particles adhere, wherein fine silver particles of nano-order particle size are adhered to the surface of each silver powder particle. The powder particles of the silver powder of fine silver particles each to which fine silver particles adhere have excellent dispersibility.