Patents by Inventor Katsuhisa Oosako

Katsuhisa Oosako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive metal paste and method for production thereof
    Patent number: 7081214
    Abstract: This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: July 25, 2006
    Assignees: Harima Chemicals, Inc., ULVAC, Inc.
    Inventors: Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Goto, Masayuki Ueda, Katsuhisa Oosako, Masaaki Oda, Norimichi Saito, Toshihiro Suzuki, Noriyuki Abe
  • Electroconductive metal paste and method for production thereof
    Publication number: 20040004209
    Abstract: This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.
    Type: Application
    Filed: April 21, 2003
    Publication date: January 8, 2004
    Inventors: Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Goto, Masayuki Ueda, Katsuhisa Oosako, Masaaki Oda, Norimichi Saito, Toshihiro Suzuki, Noriyuki Abe