Abstract: One aspect of the present invention is a method for producing an ethylene vinyl acetate hot-melt adhesive, comprising: introducing a liquid including at least one of water and alcohol into a heating kneader while or after kneading a hot-melt adhesive material in a liquid state, at an amount of 0.05 parts by mass or more with respect to 100 parts by mass of the hot-melt adhesive material; and performing vacuuming while heating stirring or dispersing the hot-melt adhesive material and the liquid so as to come into contact with each other.

Abstract: One aspect of the present invention is a hot melt composition containing a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst, wherein the silane coupling agent is hydrolyzed to a compound having a boiling point of 70 to 180° C.

Abstract: One aspect of the present invention is a hot melt composition including a modified thermoplastic polymer having an alkoxysilyl group in a molecule; a softener; and a catalyst.

Abstract: One aspect of the present invention is a hot melt composition including a modified thermoplastic polymer having an alkoxysilyl group in a molecule; a softener; and a catalyst.

Abstract: One aspect of the present invention is a hot melt composition containing a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst, wherein the silane coupling agent is hydrolyzed to a compound having a boiling point of 70 to 180° C.

Abstract: One aspect of the present invention resides in a hot melt adhesive including a thermoplastic polymer and a tackifier, wherein the tackifier includes an acid-modified tackifier that is modified by at least one of maleic acid and maleic anhydride, and by at least one selected from the group consisting of acrylic acid, methacrylic acid, an acrylic acid ester, and a methacrylic acid ester.

Abstract: One aspect of the present invention resides in a hot melt adhesive including a thermoplastic polymer and a tackifier, wherein the tackifier includes an acid-modified tackifier that is modified by at least one of maleic acid and maleic anhydride, and by at least one selected from the group consisting of acrylic acid, methacrylic acid, an acrylic acid ester, and a methacrylic acid ester.

Abstract: A hot melt adhesive composition comprising (A) 60 to 98 wt. % of a propylene-ethylene copolymer, (B) 2 to 40 wt. % of a maleic anhydride-modified polypropylene wax having a softening point of 120 to 170° C. and serving as a tackifier, and when required, (C) an antioxidant in an amount of 0.1 to 5.0 wt. % based on the combined amount of (A) and (B).

Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.

Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.

Abstract: The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using the copper foil or a copper clad laminate for the internal layer as the cathode.

Abstract: The present invention relates to a method of treating the surface of the copper foil used in printed wire boards, in which the copper foil, of which the surface thereof was preliminarily roughened, is electrolytically treated in an aqueous solution of zinc chromate containing zinc ions and chromium (VI) ions at a definite range of ratio; the thus-treated copper foil is then preferably immersed in an aqueous solution containing amino silane, sodium silicate and/or potassium silicate at a definite ratio.The use of the so-treated copper foil in multi-layer glass/epoxy printed wire boards (NEMA grade, FR4, FR5) serves to prevent the generation of brown spottings and the elimination of the delamination of the copper conductors. In addition, the use of the so treated copper foil in flame resistant paper/phenol printed wiring boards (NEMA grade FR2) leads to the elimination of the poor adhesive properties and delamination of copper conductors.