Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

Abstract: According to an embodiment, a thermosetting epoxy resin composition including an epoxy resin, an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound is provided. The aromatic amine compound is represented by the following general formula (1) (where R1 represents an alkyl group, m represents an integer of 2 or more, n represents an integer of 0 or more, and m and n satisfy m+n?6, and when n is an integer of 2 or more, a plurality of R1 may be the same as or different from each other).

Abstract: A method of manufacturing a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate, and a metal foil disposed on the insulating later, the method including: forming, on at least one of the metal substrate and the metal foil, a film that includes a composition containing a bisphenol cyanate resin, a novolac cyanate resin and an inorganic filler; obtaining a laminate by joining the metal substrate and the metal foil to face each other with the film interposed therebetween; and heating the laminate at a temperature higher than 200° C. to form a crosslinked copolymer consisting of the bisphenol cyanate resin and the novolac cyanate resin in the film, and to obtain the insulating layer comprising the crosslinked copolymer.

Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

Abstract: A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.

Abstract: Disclosed is a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate and a metal foil disposed on the insulating layer. Characteristically, the insulating layer contains a crosslinked copolymer of bisphenol cyanate resin and novolac cyanate resin and an inorganic filler.

Abstract: A nipple coating member and a milking device for gathering mother's milk effectively. The pad of a milking device comprises a tubular frame having a large diameter side opening for inserting the nipple formed on one end side and a small diameter side opening formed on the other end side, a first flexible portion provided at a part in the circumferential direction between the large diameter side opening and the small diameter side opening of the tubular frame, and a second flexible portion provided at a position opposing the first flexible portion independently thereof. The first flexible portion can be deformed inward of the tubular frame by a pressing force from the outside of the pad, and the second flexible portion can be deformed outward of the tubular frame by a pressing force from the inside of the pad.

Abstract: A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.

Abstract: A nipple coating member and a milking device for gathering mother's milk effectively. The pad of a milking device comprises a tubular frame having a large diameter side opening for inserting the nipple formed on one end side and a small diameter side opening formed on the other end side, a first flexible portion provided at a part in the circumferential direction between the large diameter side opening and the small diameter side opening of the tubular frame, and a second flexible portion provided at a position opposing the first flexible portion independently thereof. The first flexible portion can be deformed inward of the tubular frame by a pressing force from the outside of the pad, and the second flexible portion can be deformed outward of the tubular frame by a pressing force from the inside of the pad.