Patents by Inventor Katsumi Okabe

Katsumi Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240059049
    Abstract: A light modulating device includes a first transparent substrate, a second transparent substrate, a light modulating cell disposed between the first transparent substrate and the second transparent substrate, a first bonding layer disposed between the first transparent substrate and the light modulating cell, and a second bonding layer disposed between the second transparent substrate and the light modulating cell. The first bonding layer and the second bonding layer each are a bonding element containing a non-pressure-sensitive adhesive component. The first bonding layer is an OCR, and the second bonding layer is an OCA.
    Type: Application
    Filed: December 22, 2021
    Publication date: February 22, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takao IKEZAWA, Isamu SHIRAISHI, Atsushi TAMAKI, Hirofumi HAYASHI, Katsumi OKABE, Yoshiko NAKASHIMA
  • Patent number: 4901193
    Abstract: An electronic apparatus including a flexible circuit board, with an electric wiring pattern, having an opening therein, an a supporter for supporting the flexible circuit board, the supporter being provided with an least one protruding member, wherein the protruding member is inserted into the opening of the flexible circuit board, so that the flexible circuit board with the wiring pattern is folded over both sides of said supporter means.
    Type: Grant
    Filed: August 7, 1987
    Date of Patent: February 13, 1990
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Seiichi Kinugawa, Seio Kainoh, Takashi Kawashima, Katsumi Okabe