Patents by Inventor Katsunori Iizuka

Katsunori Iizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TONER, TONER SET, IMAGE TRANSFER SHEET, TONER ACCOMMODATING UNIT, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD
    Publication number: 20240160121
    Abstract: A toner has a softening point Ts of below 50 degrees C. and a tangent method glass transition temperature Tg2nd of below 0 degrees C.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Toyoshi Sawada, Kazumi Suzuki, Katsunori Kurose, Motoshi Iizuka
  • Wafer processing machine
    Patent number: 7022000
    Abstract: A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: April 4, 2006
    Assignee: Disco Corporation
    Inventors: Yasutaka Mizomoto, Ichiro Yamahata, Toshimitsu Goto, Masanori Izumita, Katsunori Iizuka, Shinji Yasuda
  • Wafer processing machine
    Publication number: 20050118938
    Abstract: A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.
    Type: Application
    Filed: November 22, 2004
    Publication date: June 2, 2005
    Inventors: Yasutaka Mizomoto, Ichiro Yamahata, Toshimitsu Goto, Masanori Izumita, Katsunori Iizuka, Shinji Yasuda