Abstract: An electrical waveform adjuster capable of adjusting various voltage waveforms supplied to an electric apparatus to improve an operation capability of the electric apparatus, and to provide an electrical waveform adjuster capable of mitigating physical harmful effects on a user of the apparatus. The waveform adjuster can be provided either in a connection line between a power feeding line for feeding an alternating-current voltage to an electric apparatus and a power factor adjusting capacitor connected in parallel with the power feeding line, or in a connection line connected in parallel or in series with a power feeding line for feeding an alternating-current voltage to an electric apparatus. The waveform adjuster includes at least one mass comprised of a conductive material attached to the connection line, a ceramic outer frame formed to enclose the mass; and a non-conductive filling material provided between the outer frame and the mass.

Abstract: An object of the present invention is to provide an electrical waveform adjuster capable of adjusting various voltage waveforms supplied to an electric apparatus to improve an operation capability of the electric apparatus, and also, to provide an electrical waveform adjuster capable of mitigating physical harmful effects on a user of the electric apparatus. As shown in FIG. 1A, an electrical waveform adjuster including a power factor adjusting capacitor 6 connected in parallel with a power feeding line 3 for feeding an alternating-current voltage to an electric apparatus, is characterized in that at least one or more low-resistance line sections having lower line resistivity than that of a connection line 4 for electrically connecting the power feeding line 3 and the power factor adjusting capacitor 6 are provided in the connection line as an adjusting circuit 5.

Abstract: The present invention relates to a thick film resistor material which is suitable especially for thick film hybrid IC having conductor, resistor, semiconductor element and the like in which Cu is used as the conductor and furthermore, a thick film resistor composition which can be fired in a reducing atmosphere. The present invention further relates to a thick film hybrid IC using the thick film resistor composition as a resistor and a method for making it.

Abstract: In a semiconductor device such as hybrid IC, thermal heads, etc., a thick film resistor of the semiconductor device contains a boride particle of a metal dispersed in a glass matrix, the particle having a particles size of 0.005 to 0.1 .mu.m. Generation of a thermal stress can be suppressed and the electroconductive particles themselves form isotropic electroconductive passages by such dispersion, and the semiconductor devices can have a distinguished electroconductivity. Preferable boride of a metal is LaB.sub.6, which gives distinguished resistor characteristics.