Abstract: This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by Formula (1) below E-M-S-M-E??(1) (where E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer). Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.

Abstract: A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R5 and R6 are independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.

Abstract: This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by the following formula: E-M-S-M-E, wherein E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer. Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.

Abstract: This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more.

Abstract: A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula 1

Abstract: A device allows for continuous regulation of the composition of a fluid mixture that includes at least two components of different polarities. The device is designed, for example, to be inserted in a separation system that the device supplies with a carrier fluid of stabilized composition. The device includes a storage tank (3) receiving a mixture coming from the separation system and at least one auxiliary vessel (6) containing one of the components of the mixture. To control the transfer of this component from auxiliary vessel (6) to storage tank (3), the device further includes at least one tubular capacitive sonde (CS) totally immersed in the fluid mixture, a sonde (TS) for measuring the temperature of the mixture, and a sondc (LS) for measuring the mixture level in storage tank (3).

Abstract: A semiconductor device includes a circuit substrate having the metallic bumps electrically connected through lands on both the front side of the substrate where the semiconductor elements are to be mounted and the opposite side thereof. The semiconductor elements are connected to the metallic bumps on the front side of the substrate and a thermosetting resin composition containing a spherical filler is disposed between the semiconductor elements and the substrate.

Abstract: A thermosetting resin composition obtained by heat treating, under the specified conditions, a mixture of a polyaddition thermosetting resin, a silicic compound (oligomer) having a functional group capable of causing an addition reaction with a curing agent for the polyaddition thermosetting resin, and water, followed by adding of a curing agent for the polyaddition thermosetting resin is useful for producing thermosetting resin molded articles, resin encapsulated semiconductor devices, automobile parts, etc., which are high in heat resistance, small in change of elastic modulus at high temperatures, and resistant to crack and peeling.

Abstract: A highly thermal-conductive and thermal-resistant electrically insulated coil with less outflow of a thermosetting resin composition can be produced, to provide a small-scale, light-weight rotating machine with high power. The thermosetting resin composition comprises (a) a polyfunctional epoxy resin containing three or more p-(2,3-epoxypropoxy) phenyl groups and a group represented by the Chemical formula 1; or an epoxy resin with a naphthalene backbone, represented by the Chemical formula 3, 4 or 5 or an epoxy resin with an anthracene backbone, such as diglycidyl ether of anthracene diol and triglycidyl ether of anthracene triol; (b) a bifunctional epoxy resin containing two p-(2,3-epoxypropoxy) phenyl groups; (c) an acid anhydride curing agent; and (d) a metal acetonate curing catalyst represented by the Chemical formula 2 at 0.1 to 5 parts by weight per 100 parts by weight of the epoxy resins.

Abstract: In the production of electrically insulated coils which make up insulating layers, insulating material is wound around an electric conductor to form an insulating substrate, then impregnating varnish consisting of thermosetting resin is applied to the insulating substrate and hardened. In this electrically insulated coil production method, the impregnating varnish is made up of acid anhydride setting epoxy resin elements that include latent accelerators. These accelerators take more than 30 days to increase their initial viscosity by three times during storage at 25 degrees centigrade. After the insulating substrate is impregnated with the varnish, the substrate is heated at a temperature which will cause the impregnating varnish on the surface of the insulating substrate to lose its fluidity in under 30 minutes in order to preset the varnish.

Abstract: A phosphoric triester containing at least one aromatic ring is mixed in an amount of 30 to 80% by weight based on the total constituents with a benzenetricarboxylic acid trialkyl ester or with a polyol ester obtained from trimethylolpropane and a saturated fatty acid to give a fire-retardant insulating oil.