Patents by Inventor Katsushi Ito

Katsushi Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240188245
    Abstract: Provided is an electronic apparatus in which a state where a cable is in contact with a ground part can be stably maintained for a long period of time. An electronic apparatus includes a shield that is in contact with a ground pattern on a circuit board and that functions as a ground part. The cable extends from a front antenna, is connected to the circuit board, and passes between the shield and a first cushioning member. An inner surface of the housing presses the first cushioning member against the shield.
    Type: Application
    Filed: April 18, 2022
    Publication date: June 6, 2024
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Katsushi Ito, Kazutaka Eto, Kazuya Odagiri, Sho Kobayashi
  • Patent number: 11985766
    Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: May 14, 2024
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Katsushi Ito, Yasuhiro Ootori, Nobuyuki Sugawara
  • Patent number: 11943868
    Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Katsushi Ito, Yasuhiro Ootori, Nobuyuki Sugawara
  • Patent number: 11943898
    Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Nobuyuki Sugawara, Katsushi Ito
  • Publication number: 20230327354
    Abstract: Disclosed herein is an electronic device including a first circuit board on which a first connector is mounted, a second circuit board on which a second connector connected to the first connector via a cable is mounted, a circuit board shield that covers the first circuit board and exposes the first connector, and a connector shield that is attached to the circuit board shield to cover the first connector and is removable from the circuit board shield.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 12, 2023
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Shinya Tsuchida, Katsushi Ito, Nobuyuki Sugawara
  • Publication number: 20230328940
    Abstract: Provided is an electronic device including a circuit board having a first surface and a second surface, a first member covering the first surface to function as a shield of the circuit board and having a first encompassing region having, in at least a portion thereof, a first outer region, and a second member that is placed on a side of the second surface that has a second outer region. One of the first and the second outer regions has at least one outer fixed portion fixed to another of the first and the second outer regions and at least one projection located away from the at least one outer fixed portion in a direction along an outer edge of the circuit board. The first and the second members are in contact with each other with the at least one outer fixed portion and the at least one projection.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 12, 2023
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Shinya Tsuchida, Katsushi Ito, Nobuyuki Sugawara, Tetsufumi Nozawa
  • Publication number: 20230116950
    Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.
    Type: Application
    Filed: March 23, 2021
    Publication date: April 20, 2023
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Katsushi ITO, Yasuhiro OOTORI, Nobuyuki SUGAWARA
  • Publication number: 20230097177
    Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).
    Type: Application
    Filed: March 23, 2021
    Publication date: March 30, 2023
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Nobuyuki SUGAWARA, Katsushi ITO
  • Publication number: 20220232693
    Abstract: Electronic equipment includes an option equipment attachment portion at a bottom portion of the electronic equipment. The electronic equipment includes an optional printed circuit board and a lower shield member covering the optional printed circuit board with a part of the optional printed circuit board exposed from the lower shield member. The lower shield member includes a recess including walls as inner walls. A region of the optional printed circuit board exposed from the lower shield member 34 is located at a bottom portion of the recess and is surrounded by the walls of the lower shield member.
    Type: Application
    Filed: May 21, 2020
    Publication date: July 21, 2022
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Yuta Tamaki, Katsushi Ito
  • Patent number: 8604117
    Abstract: A resin composition is provided which is improved in fluidability, stiffness and impact resistance and therefore can achieve the reduction in wall thickness of a resin product for automotive interior/exterior applications comprising a polypropylene resin; and a resin product produced from the resin composition. The resin composition comprises 30 to 65 mass % of an ethylene-propylene block copolymer having a melt flow rate of 60 to 120 g/10 minutes and a Charpy impact strength of 3 kJ/m2 or more; 0 to 25 mass % of a homopolypropylene resin having a melt flow rate of 10 g/10 minutes or more and a modulus of elasticity of 2000 MPa or more; 5 to 20 mass % of an ethylene-?-olefin copolymer rubber having a Mooney viscosity of 20 to 75 or a styrene-ethylene butylenes-styrene copolymer having a styrene component content of 15 to 30 mass %; and 23 to 37 mass % of talc having an average particle diameter of 8 ?m or less.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: December 10, 2013
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Masao Kobayashi, Koichi Ogiso, Katsushi Ito, Kiyoshi Suenaga
  • Patent number: 8596432
    Abstract: While comprising filled minor compartments being filled with an inclusion in which a liquid makes the major component, and vacant minor compartments being filled with the air, at least one of the vacant minor compartments adjoins the filled minor compartments, and a fragile section is formed in at least one of ribs that demarcate the filled minor compartments and the adjoining vacant minor compartments. After the fragile section has fractured, shock energy can be absorbed furthermore by means of circulation resistance to the inclusion that flows from the filled minor compartments to the vacant minor compartments.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: December 3, 2013
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Chiharu Totani, Muneo Furutani, Kiyoshi Suenaga, Takehiko Shiraki, Shigeru Yabuya, Katsuhiro Katagiri, Katsushi Ito
  • Patent number: 8236893
    Abstract: The polylactic acid based resin molded article is a molded article formed from a polylactic acid based resin composition comprising a polylactic acid based resin (A), a polypropylene (B) having a crystallinity of 20% by weight or less and a modified ethylene-?-olefin copolymer (C1) or a modified polyolefin (C2), wherein a treatment for accelerating crystallization of the polylactic acid based resin (A) is applied thereto. In the polylactic acid based resin composition, the polypropylene (B) having a crystallinity of 20% by weight or less is blended in an amount of from 10 to 90 parts by weight based on 90 to 10 parts by weight of the polylactic acid based resin (A). In addition, the modified ethylene-?-olefin copolymer (C1) or the modified polyolefin (C2) is blended in an amount of from 1 to 20 parts by weight based on 100 parts by weight in total of the polylactic acid based resin (A) and the polypropylene (B) having a crystallinity of 20% by weight or less.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: August 7, 2012
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Hiroyuki Nakagawa, Katsushi Ito
  • Publication number: 20110024250
    Abstract: The present invention provides a shock absorbing member which includes a pair of opposing plates and a plurality of resin tubes internally filled with a viscous body. Both end surfaces of the resin tubes are closed by the pair of the plates. The each resin tube is disposed between the pair of the plates and is surrounded by a space not filled with the viscous body. When a shock in a direction of bringing the pair of the plates closer to each other is applied, the resin tube is buckled toward the surrounding space and the viscous body leaks out from a crack generated in the resin tube by the buckling to absorb the shock.
    Type: Application
    Filed: May 27, 2010
    Publication date: February 3, 2011
    Applicant: TOYODA GOSEI CO., LTD.
    Inventors: Masayuki Kitashiba, Chiharu Totani, Katsushi Ito, Katsutoshi Mizuno
  • Publication number: 20100300824
    Abstract: While comprising filled minor compartments being filled with an inclusion in which a liquid makes the major component, and vacant minor compartments being filled with the air, at least one of the vacant minor compartments adjoins the filled minor compartments, and a fragile section is formed in at least one of ribs that demarcate the filled minor compartments and the adjoining vacant minor compartments. After the fragile section has fractured, shock energy can be absorbed furthermore by means of circulation resistance to the inclusion that flows from the filled minor compartments to the vacant minor compartments.
    Type: Application
    Filed: January 27, 2009
    Publication date: December 2, 2010
    Inventors: Chiharu Totani, Muneo Furutani, Kiyoshi Suenaga, Takehiko Shiraki, Shigeru Yabuya, Katsuhiro Katagiri, Katsushi Ito
  • Publication number: 20100137498
    Abstract: A resin composition is provided which is improved in fluidability, stiffness and impact resistance and therefore can achieve the reduction in wall thickness of a resin product for automotive interior/exterior applications comprising a polypropylene resin; and a resin product produced from the resin composition. The resin composition comprises 30 to 65 mass % of an ethylene-propylene block copolymer having a melt flow rate of 60 to 120 g/10 minutes and a Charpy impact strength of 3 kJ/m2 or more; 0 to 25 mass % of a homopolypropylene resin having a melt flow rate of 10 g/10 minutes or more and a modulus of elasticity of 2000 MPa or more; 5 to 20 mass % of an ethylene-?-olefin copolymer rubber having a Mooney viscosity of 20 to 75 or a styrene-ethylene butylenes-styrene copolymer having a styrene component content of 15 to 30 mass %; and 23 to 37 mass % of talc having an average particle diameter of 8 ?m or less.
    Type: Application
    Filed: August 8, 2008
    Publication date: June 3, 2010
    Applicant: TOYODA GOSEI CO., LTD.
    Inventors: Masao Kobayashi, Koichi Ogiso, Katsushi Ito, Kiyoshi Suenaga
  • Patent number: 7479315
    Abstract: A material for fuel-system parts which is excellent in impact strength, rigidity, elongation, unsusceptibility to swelling with liquid fuels including gasoline, and gasoline-barrier properties and has satisfactory moldability. The material for fuel-system parts comprises a resin composition comprising 100 parts by weight of a given polyamide resin (A) and 11 to 100 parts by weight of a resin (B) having a lower glass transition temperature than the polyamide resin (A) and having a functional group reactive with the polyamide resin (A), and has a structure in which the polyamide resin (A) serves as a matrix ingredient and the resin (B) serves as a domain ingredient.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: January 20, 2009
    Assignees: Toyo Boseki Kabushiki Kaisha, Toyoda Gosei Co., Ltd
    Inventors: Tsutomu Tamura, Tomohide Nakagawa, Shoji Kouketsu, Gaku Maruyama, Daisuke Tsutsumi, Junji Koizumi, Katsushi Ito, Haruyasu Mizutani
  • Publication number: 20080076880
    Abstract: The polylactic acid based resin molded article is a molded article formed from a polylactic acid based resin composition comprising a polylactic acid based resin (A), a polypropylene (B) having a crystallinity of 20% by weight or less and a modified ethylene-?-olefin copolymer (C1) or a modified polyolefin (C2), wherein a treatment for accelerating crystallization of the polylactic acid based resin (A) is applied thereto. In the polylactic acid based resin composition, the polypropylene (B) having a crystallinity of 20% by weight or less is blended in an amount of from 10 to 90 parts by weight based on 90 to 10 parts by weight of the polylactic acid based resin (A). In addition, the modified ethylene-?-olefin copolymer (C1) or the modified polyolefin (C2) is blended in an amount of from 1 to 20 parts by weight based on 100 parts by weight in total of the polylactic acid based resin (A) and the polypropylene (B) having a crystallinity of 20% by weight or less.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 27, 2008
    Applicant: TOYODA GOSEI CO., LTD.
    Inventors: Hiroyuki Nakagawa, Katsushi Ito
  • Publication number: 20070149706
    Abstract: The present invention provides a material for a fuel system part, which is superior in impact strength, rigidity, elongation, swelling resistance to liquid fuels such as gasoline and the like, and gasoline barrier property, as well as moldability, which contains resin (B) having a glass transition temperature lower than that of a certain polyamide resin (A) and a functional group capable of reacting with the polyamide resin (A), at a ratio of 11-100 parts by weight relative to 100 parts by weight of the polyamide resin (A), wherein the polyamide resin (A) is a matrix component, and the resin (B) is a domain component, and further a fuel system containing this material.
    Type: Application
    Filed: December 8, 2003
    Publication date: June 28, 2007
    Inventors: Tsutomu Tamura, Tomohide Nakagawa, Shoji Kouketsu, Gaku Maruyama, Daisuke Tsutsumi, Junji Koizumi, Katsushi Ito, Haruyasu Mizutani
  • Patent number: 7013474
    Abstract: A disk drive apparatus has a main apparatus, a disk tray, a disk rotational drive unit, an optical pickup mechanism, a movable member, an elevator drive mechanism, a protrusion provided on the movable member, and a vibration-absorbing member provided on the protrusion. The disk tray causes a disk to move between a stored position and a drawn-up position relative to the main apparatus. The movable member supports the disk rotational drive unit and the optical pickup mechanism and is mounted to the frame of the main apparatus so that one end is free to rotate. The elevator drive mechanism causes the disk rotational drive unit and optical pickup mechanism to approach and move away from the disk, with the movable member free to move up and down. The protrusion extends toward one end of the movable member. The movable member is provided with the vibration-absorbing member.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: March 14, 2006
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Katsushi Ito, Yuji Shida
  • Publication number: 20030091834
    Abstract: A coated plastic molding having a final coating on a molding body formed of plastic material and having elastic modulus in tension of from about 10 to about 2,000 MPa. The coated plastic molding has such a relationship that a ratio E′/E is 0.5 or more when the elastic modulus in tension of the molding body is E and the elastic modulus in tension of the final coating is E′.
    Type: Application
    Filed: July 5, 2002
    Publication date: May 15, 2003
    Applicant: TOYODA GOSEI, LTD.
    Inventors: Hiroshi Watarai, Hiroki Hattori, Junji Koizumi, Katsushi Ito