Patents by Inventor Katsushi Sugai

Katsushi Sugai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9176169
    Abstract: A probe apparatus providing an electrical connection between a device under test and a test apparatus body, comprising a device-side terminal unit including a flexible sheet and device-side connection terminals passing through the sheet and connected to the device under test; an intermediate substrate provided on the test apparatus body side of the device-side terminal unit and including device-side intermediate electrodes electrically connected to the device-side connection terminals and tester-side intermediate electrodes electrically connected to the test apparatus body; a tester-side substrate that is provided on the test apparatus body side of the intermediate substrate and includes, on the intermediate substrate side thereof, tester-side electrodes electrically connected to the test apparatus body; and a contact section provided between the intermediate substrate and the tester-side substrate and including first pins connected to the tester-side intermediate electrodes and second pins connected to the t
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: November 3, 2015
    Assignee: ADVANTEST CORPORATION
    Inventor: Katsushi Sugai
  • Patent number: 8922232
    Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: December 30, 2014
    Assignees: Advantest Corporation, Shinko Electric Industries Co., Ltd.
    Inventors: Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi
  • Patent number: 8779791
    Abstract: A probe includes a plurality of boards each of which has a plurality of magnets, a plurality of the boards include a first board and a second board laid on the first board, a plurality of the magnets include a plurality of first magnets provided with the first board and a plurality of second magnets provided with the second board and arranged so as to respectively face a plurality of the first magnets, and the first magnet and the second magnet facing each other are provided so that mutually different magnetic poles face each other.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: July 15, 2014
    Assignee: Advantest Corporation
    Inventors: Yoshiharu Umemura, Katsushi Sugai
  • Publication number: 20140145742
    Abstract: A probe apparatus providing an electrical connection between a device under test and a test apparatus body, comprising a device-side terminal unit including a flexible sheet and device-side connection terminals passing through the sheet and connected to the device under test; an intermediate substrate provided on the test apparatus body side of the device-side terminal unit and including device-side intermediate electrodes electrically connected to the device-side connection terminals and tester-side intermediate electrodes electrically connected to the test apparatus body; a tester-side substrate that is provided on the test apparatus body side of the intermediate substrate and includes, on the intermediate substrate side thereof, tester-side electrodes electrically connected to the test apparatus body; and a contact section provided between the intermediate substrate and the tester-side substrate and including first pins connected to the tester-side intermediate electrodes and second pins connected to the t
    Type: Application
    Filed: September 13, 2013
    Publication date: May 29, 2014
    Applicant: ADVANTEST CORPORATION
    Inventor: Katsushi Sugai
  • Publication number: 20120049876
    Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322. [Selected Drawing] FIG.
    Type: Application
    Filed: August 18, 2011
    Publication date: March 1, 2012
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., ADVANTEST CORPORATION
    Inventors: Shigeru MATSUMURA, Kohei KATO, Katsushi SUGAI, Koichi SHIROYAMA, Mitsutoshi HIGASHI, Akinori SHIRAISHI, Hideaki SAKAGUCHI
  • Publication number: 20120038382
    Abstract: A probe includes a plurality of boards each of which has a plurality of magnets, a plurality of the boards include a first board and a second board laid on the first board, a plurality of the magnets include a plurality of first magnets provided with the first board and a plurality of second magnets provided with the second board and arranged so as to respectively face a plurality of the first magnets, and the first magnet and the second magnet facing each other are provided so that mutually different magnetic poles face each other.
    Type: Application
    Filed: April 7, 2010
    Publication date: February 16, 2012
    Applicant: ADVANTEST CORPORATION
    Inventors: Yoshiharu Umemura, Katsushi Sugai