Patents by Inventor Katsuyasu Hirata

Katsuyasu Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7757464
    Abstract: A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: July 20, 2010
    Assignee: Toshiba Matsushita Display Technology Co., Ltd.
    Inventors: Katsuyasu Hirata, Osamu Shimada, Kazuhiro Ohashi, Takayuki Iizuka, Hiroshi Shintani
  • Patent number: 7681376
    Abstract: A method for manufacturing electronic, electric or other products such as flat-panel display devices, for coping with change of product size and for curbing damage on the products and dust generation by smaller cost of packaging, according to one embodiment, comprising; sequentially placing first products as to be sandwiched by a resin-sheet band and as to be arrayed in a row while forming joined areas as to form receptacles respectively for the first products, thus forming a band-shaped package; winding the band-shaped package around a shock-absorbent core and placing them into an inner box as non-displaceable; placing the inner box in an outer box as to be supported from inner face of the outer box through partitions or spacers; and then transporting or storing in such a state while keeping the resin-sheet face as substantially vertical, as to be used for producing second products.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: March 23, 2010
    Assignee: Toshiba Matsushita Display Technology Co., Ltd,
    Inventors: Katsuyasu Hirata, Takayuki Iizuka
  • Publication number: 20070077847
    Abstract: A method for manufacturing electronic, electric or other products such as flat-panel display devices, for coping with change of product size and for curbing damage on the products and dust generation by smaller cost of packaging, according to one embodiment, comprising; sequentially placing first products as to be sandwiched by a resin-sheet band and as to be arrayed in a row while forming joined areas as to form receptacles respectively for the first products, thus forming a band-shaped package; winding the band-shaped package around a shock-absorbent core and placing them into an inner box as non-displaceable; placing the inner box in an outer box as to be supported from inner face of the outer box through partitions or spacers; and then transporting or storing in such a state while keeping the resin-sheet face as substantially vertical, as to be used for producing second products.
    Type: Application
    Filed: October 2, 2006
    Publication date: April 5, 2007
    Applicant: Toshiba Matsushita Display Technology Co., Ltd.
    Inventors: Katsuyasu Hirata, Takayuki Iizuka
  • Publication number: 20050241988
    Abstract: A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.
    Type: Application
    Filed: April 1, 2005
    Publication date: November 3, 2005
    Applicant: Toshiba Matsushita Display Technology Co., Ltd.
    Inventors: Katsuyasu Hirata, Osamu Shimada, Kazuhiro Ohashi, Takayuki Iizuka, Hiroshi Shintani