Abstract: A pellet bonding apparatus is disclosed, which comprises a wafer stage, a pellet removal/transfer mechanism, a pellet position correcting mechanism, and a bonding mechanism. In the wafer stage, the wafer ring unit can be rotated through an angle corresponding to each of a plurality of areas, into which a pellet group of a wafer ring unit provided on the wafer stage can be divided. The pellet position correcting mechanism rotates a rotary table through a predetermined angle irrespective of whether the wafer ring unit has been rotated or not, whereby pellet position correction is made such that the pellet has the same orientation at all times when being removed by the bonding mechanism. A sheet expander can set the wafer ring unit on the wafer stage. It has an expander ring with an end formed with air stream outlet ports.