Abstract: A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.

Abstract: A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.

Abstract: A method for processing a substrate and an apparatus for processing a substrate are provided, where a substrate can be prevented from being damaged during conveyance of the substrate, including turning over of the substrate, and the apparatus for processing a substrate having this mechanism for conveying a substrate is miniaturized, so that the area for installment can be reduced.