Abstract: A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.

Abstract: A wiring substrate includes a conductor pad, an insulating layer formed on the conductor pad such that the insulating layer is covering the conductor pad and has a through hole, a bump formed on the conductor pad such that the bump is formed in the through hole penetrating through the insulating layer. The conductor pad is formed such that the conductor pad has a connecting surface connected to the bump, a concave part formed on the connecting surface of the conductor pad to the bump, and a convex part formed in the concave part.

Abstract: A wheel steering device for a vehicle, including: a steering knuckle that constitutes a part of a suspension device and that is capable of moving relative to a body of the vehicle in an up-down direction, the steering knuckle holding a wheel such that the wheel is rotatable; and a steering actuator configured to cause the steering knuckle to be pivoted about a kingpin axis so steer the wheel, wherein a caster angle and a caster offset are both 0.

Abstract: A wiring substrate includes a conductor pad, an insulating layer formed on the conductor pad such that the insulating layer is covering the conductor pad and has a through hole, a bump formed on the conductor pad such that the bump is formed in the through hole penetrating through the insulating layer. The conductor pad is formed such that the conductor pad has a connecting surface connected to the bump, a concave part formed on the connecting surface of the conductor pad to the bump, and a convex part formed in the concave part.

Abstract: A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.

Abstract: A wheel steering device for a vehicle, including: a steering knuckle that constitutes a part of a suspension device and that is capable of moving relative to a body of the vehicle in an up-down direction, the steering knuckle holding a wheel such that the wheel is rotatable; and a steering actuator configured to cause the steering knuckle to be pivoted about a kingpin axis so steer the wheel, wherein a caster angle and a caster offset are both 0.

Abstract: A steering device, including: a steering knuckle rotatably holding a wheel and pivotally supported by a suspension arm through a first joint; a steering actuator disposed on the suspension arm; and a tie rod a proximal end portion of which is coupled to the steering actuator and a distal end portion of which is coupled to the steering knuckle through a second joint.

Abstract: A vehicle-height control system includes: a fluid supply and discharge device including a compressor device and a tank storing fluid pressurized by the compressor device; a vehicle-height control actuator corresponding to a wheel and connected to the fluid supply and discharge device; a vehicle height controller that controls a vehicle height for the wheel by controlling the fluid supply and discharge device to control supply and discharge of fluid to and from the vehicle-height control actuator; a tank pressure controller that controls a tank pressure; and a fluid supply controller that supplies the fluid to a low pressure portion by controlling the fluid supply and discharge device at start and/or termination of at least one of control executed by the vehicle height controller and control executed by the tank pressure controller. The low pressure portion is at least a portion of the fluid supply and discharge device.

Abstract: A vehicle-height control system is configured to control a vehicle height for a wheel. The vehicle-height control system includes: a vehicle-height control actuator provided so as to correspond to the wheel; a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height control actuator; and a vehicle height controller configured to control the vehicle height for the wheel by controlling the pressure-medium supply and discharge device based on an inside temperature and an outside-air temperature to control at least one of supply and discharge of the pressure medium to and from the vehicle-height control actuator. The inside temperature is a temperature in the vehicle-height control system.

Abstract: A vehicle-height adjustment system includes: a vehicle-height adjustment actuator provided so as to correspond to a wheel; and a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height adjustment actuator. The pressure-medium supply and discharge device includes a tank configured to store the pressure medium. The vehicle-height adjustment system includes a tank-pressure controller configured to control a tank pressure based on at least one of a vehicle height for the wheel and an inside temperature. The tank pressure is a pressure of the pressure medium stored in the tank, and the inside temperature is a temperature in the vehicle-height adjustment system.

Abstract: A vehicle height adjustment system includes: a vehicle height adjustment actuator provided for each wheel of a vehicle; a pressure medium intake and exhaust device configured to supply and exhaust a pressure medium to and from the vehicle height adjustment actuator; and a vehicle height adjustment unit including a computer, the vehicle height adjustment unit configured to: adjust a vehicle height by controlling the pressure medium intake and exhaust device, the vehicle height being a distance between the wheel and a vehicle body; adjust the vehicle height when a get-in estimation condition is satisfied; and limit a number of times the vehicle height is adjusted within a set period to a number of times smaller than a set number of times.

Abstract: A vehicle-height control system includes: a fluid supply and discharge device including a compressor device and a tank storing fluid pressurized by the compressor device; a vehicle-height control actuator corresponding to a wheel and connected to the fluid supply and discharge device; a vehicle height controller that controls a vehicle height for the wheel by controlling the fluid supply and discharge device to control supply and discharge of fluid to and from the vehicle-height control actuator; a tank pressure controller that controls a tank pressure; and a fluid supply controller that supplies the fluid to a low pressure portion by controlling the fluid supply and discharge device at start and/or termination of at least one of control executed by the vehicle height controller and control executed by the tank pressure controller. The low pressure portion is at least a portion of the fluid supply and discharge device.

Abstract: A vehicle-height adjustment system includes: a vehicle-height adjustment actuator provided so as to correspond to a wheel; and a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height adjustment actuator. The pressure-medium supply and discharge device includes a tank configured to store the pressure medium. The vehicle-height adjustment system includes a tank-pressure controller configured to control a tank pressure based on at least one of a vehicle height for the wheel and an inside temperature. The tank pressure is a pressure of the pressure medium stored in the tank, and the inside temperature is a temperature in the vehicle-height adjustment system.

Abstract: A vehicle-height control system is configured to control a vehicle height for a wheel. The vehicle-height control system includes: a vehicle-height control actuator provided so as to correspond to the wheel; a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height control actuator; and a vehicle height controller configured to control the vehicle height for the wheel by controlling the pressure-medium supply and discharge device based on an inside temperature and an outside-air temperature to control at least one of supply and discharge of the pressure medium to and from the vehicle-height control actuator. The inside temperature is a temperature in the vehicle-height control system.

Abstract: A vehicle height adjustment system includes: a vehicle height adjustment actuator provided for each wheel of a vehicle; a pressure medium intake and exhaust device configured to supply and exhaust a pressure medium to and from the vehicle height adjustment actuator; and a vehicle height adjustment unit including a computer, the vehicle height adjustment unit configured to: adjust a vehicle height by controlling the pressure medium intake and exhaust device, the vehicle height being a distance between the wheel and a vehicle body; adjust the vehicle height when a get-in estimation condition is satisfied; and limit a number of times the vehicle height is adjusted within a set period to a number of times smaller than a set number of times.

Abstract: A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 ?m and a conductor circuit 58 on an interlayer resin insulating layer 50 is formed to have a thickness of 15 ?m. By making the conductor layer 34P thick, it is possible to increase a volume of the conductor itself and decrease resistance. Further, by employing the conductor layer 34 as a power supply layer, it is possible to improve a capability of supplying power to the IC chip.

Abstract: A multilayer printed wiring board includes a core substrate having a through-hole formed through the substrate, an interlayer insulation layer formed on the substrate and having a via conductor formed through the insulation layer, and a conductor layer formed on the insulation layer and connected to the via in the insulation layer. The substrate has multiplayer insulation structure, outer power layer formed on surface of the structure, outer ground layer formed on opposite surface of the structure, inner power layer formed inside the structure and inner ground layer formed inside the structure, each of the inner layers has tapered end having angle satisfying 2.8<tan ?<55, the through-hole is penetrating through and insulated from the inner layers, and the inner layers are positioned between the outer layers such that the inner power layer is between the ground layers and the inner ground layer is between the power layers.

Abstract: An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 ?m and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 ?m. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved.

Abstract: An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 ?m and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 ?m. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved.

Abstract: A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 ?m and a conductor circuit 58 on an interlayer resin insulating layer 50 is formed to have a thickness of 15 ?m. By making the conductor layer 34P thick, it is possible to increase a volume of the conductor itself and decrease resistance. Further, by employing the conductor layer 34 as a power supply layer, it is possible to improve a capability of supplying power to the IC chip.