Patents by Inventor Katuaki Sugino

Katuaki Sugino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package body for integrated circuit
    Patent number: 5373187
    Abstract: A package body for an integrated circuit is provided with a substrate having a mounting portion for mounting the integrated circuit. A terminal member for high speed signal input-output is provided on a portion of the substrate except the mounting portion of the substrate. A high speed signal transmission line has one end portion to be connected to the integrated circuit and the other end portion connected to the terminal member and is formed at a portion of the substrate except the mounting portion of the substrate. A plating tie-bar is formed at the substrate so as to extend from an outer periphery edge of the substrate inwardly for electrolytically plating the one end portion of the high speed signal transmission line and the terminal member.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: December 13, 1994
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Katuaki Sugino, Masahito Morita