Patents by Inventor Katuhiko Yamasaki

Katuhiko Yamasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of cleaning semiconductor molding apparatus
    Patent number: 5053172
    Abstract: A molding apparatus has a fixed upper platen and a movable lower platen on which are secured an upper and a lower mold half, respectively. A cleaning device for cleaning the mold surfaces of the mold halves is installed on the upper platen, and the lower platen is open so that foreign matter will not accumulate atop it.
    Type: Grant
    Filed: September 14, 1990
    Date of Patent: October 1, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Katuhiko Yamasaki, Minoru Tanaka, Kenichiro Sakamoto
  • Molding apparatus for sealing semiconductor devices including a mold cleaning device
    Patent number: 4983115
    Abstract: A molding apparatus has a fixed upper platen and a movable lower platen on which are secured an upper and a lower mold half, respectively. A cleaning device for cleaning the mold surfaces of the mold halves is installed on the upper platen, and the lower platen is open so that foreign matter will not accumulate atop it.
    Type: Grant
    Filed: October 12, 1988
    Date of Patent: January 8, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Katuhiko Yamasaki, Minoru Tanaka, Kenichiro Sakamoto
  • Apparatus for forming leads of semiconductor devices
    Patent number: 4885837
    Abstract: An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: December 12, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Taizo Eshima, Kunihiro Yasutake, Katuhiko Yamasaki