Patents by Inventor Katushiko Tanaka

Katushiko Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7635191
    Abstract: Manufacturing method for variable shape mirrors suitable for mass production includes steps: for forming first grooves and second grooves along boundaries between areas to be variable shape mirrors on a surface of first wafer to be support substrate and a surface of second wafer to be mirror substrate; for arranging first and second wafer so that support pillars and piezoelectric elements are sandwiched between first and second wafer at areas with surface on which second grooves are formed facing inward for bonding; for dividing second wafer into mirror substrates by flattening process of outer surface of second wafer until at least reaching second groove; for dividing first wafer into the support substrates by breaking first wafer along first grooves; and for forming reflection film on outer surface of each of mirror substrates obtained by the dividing step.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: December 22, 2009
    Assignee: Funai Electric Co., Ltd.
    Inventors: Shigeo Maeda, Katushiko Tanaka, Akira Ishii, Susumu Sugiyama
  • Publication number: 20080291519
    Abstract: Manufacturing method for variable shape mirrors suitable for mass production includes steps: for forming first grooves and second grooves along boundaries between areas to be variable shape mirrors on a surface of first wafer to be support substrate and a surface of second wafer to be mirror substrate; for arranging first and second wafer so that support pillars and piezoelectric elements are sandwiched between first and second wafer at areas with surface on which second grooves are formed facing inward for bonding; for dividing second wafer into mirror substrates by flattening process of outer surface of second wafer until at least reaching second groove; for dividing first wafer into the support substrates by breaking first wafer along first grooves; and for forming reflection film on outer surface of each of mirror substrates obtained by the dividing step.
    Type: Application
    Filed: August 8, 2007
    Publication date: November 27, 2008
    Inventors: Shigeo Maeda, Katushiko Tanaka, Akira Ishii, Susumu Sugiyama
  • Patent number: 5046863
    Abstract: A dynamic pressure bearing device induced a housing having a sleeve and a thrust receiver and a shaft fit into the sleeve. Herringbone-shaped grooves for generating dynamic pressure comprising outer groove segments and inner group segments are disposed to at least one of the inner cylindrical surface of the sleeve and the outer cylindrical surface of the shaft at two axially spaced apart positions. The axial length of the outer groove segment is longer than that of the inner groove segment, and the difference of the axial length for the outer and the inner groove segments is greater in the lower herringbone-shaped grooves than in the upper herringbone-shaped grooves.
    Type: Grant
    Filed: November 7, 1990
    Date of Patent: September 10, 1991
    Assignee: Nippon Seiko Kabushiki Kaisha
    Inventors: Ikunori Sakatani, Takeyuki Yoshiba, Katushiko Tanaka