Patents by Inventor Katuya Bando

Katuya Bando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of joining metal members
    Patent number: 5511719
    Abstract: A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: April 30, 1996
    Assignee: Nippondenso Co., Ltd.
    Inventors: Toshihiro Miyake, Katuya Bando, Toshiaki Yagura, Koji Kondo