Patents by Inventor Kaumba Sakavuyi

Kaumba Sakavuyi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-silicon-content wet-removable planarizing layer
    Patent number: 11817317
    Abstract: Lithographic compositions for use as wet-removable silicon gap fill layers are provided. The method of using these compositions involves utilizing a silicon gap fill layer over topographic features on a substrate. The silicon gap fill layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred silicon gap fill layers are formed from spin-coatable, polymeric compositions with high silicon content, and these layers exhibit good gap fill and planarization performance and high oxygen etch resistance.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: November 14, 2023
    Assignee: Brewer Science, Inc.
    Inventors: Ming Luo, Yubao Wang, Kaumba Sakavuyi, Vandana Krishnamurthy
  • HIGH-SILICON-CONTENT WET-REMOVABLE PLANARIZING LAYER
    Publication number: 20210125829
    Abstract: Lithographic compositions for use as wet-removable silicon gap fill layers are provided. The method of using these compositions involves utilizing a silicon gap fill layer over topographic features on a substrate. The silicon gap fill layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred silicon gap fill layers are formed from spin-coatable, polymeric compositions with high silicon content, and these layers exhibit good gap fill and planarization performance and high oxygen etch resistance.
    Type: Application
    Filed: October 26, 2020
    Publication date: April 29, 2021
    Inventors: Ming Luo, Yubao Wang, Kaumba Sakavuyi, Vandana Krishnamurthy