Abstract: The present disclosure relates to a testing device and techniques of testing semiconductor structures and, more particularly, to an absolute phase measurement testing device and technique of testing semiconductor structures. The structure includes: a first frequency input source which provides a first signal to an up-converter at an input side of a test fixture; a down-converter on an output side of the test fixture; a second frequency signal source which provides a second signal at a higher frequency than the first signal to the up-converter and the down-converter on the output side of the test fixture; a bypass path which bypasses the test fixture and provides connection between the up-converter and the down-converter; and a digitizer that is connected to an output side of the down-converter.

Abstract: The present disclosure relates to a testing device and techniques of testing semiconductor structures and, more particularly, to an absolute phase measurement testing device and technique of testing semiconductor structures. The structure includes: a first frequency input source which provides a first signal to an up-converter at an input side of a test fixture; a down-converter on an output side of the test fixture; a second frequency signal source which provides a second signal at a higher frequency than the first signal to the up-converter and the down-converter on the output side of the test fixture; a bypass path which bypasses the test fixture and provides connection between the up-converter and the down-converter; and a digitizer that is connected to an output side of the down-converter.

Abstract: A method of redirecting signal bits associated with or corresponding to defective TSVs of a TSV array to a row or a column of redundant TSVs in the TSV array using a 2:4 Decoder and 4:2 Encoder and the resulting device are provided. Embodiments include forming a TSV array between a bottom die and a top die of a 3D IC stack, the TSV array having a row and a column of redundant TSVs; identifying a defective TSV of the TSV array; determining whether to shift a signal bit associated with or corresponding to the defective TSV in a first and/or a second direction towards the row or the column of redundant TSVs; and shifting the signal bit in the first and/or the second direction until the signal bit has been redirected to the row or the column of redundant TSVs.