Patents by Inventor Kaustubh (Kaust) Namjoshi

Kaustubh (Kaust) Namjoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
    Patent number: 7925072
    Abstract: Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: April 12, 2011
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Chien-Huei (Adam) Chen, Ajay Gupta, Richard Wallingford, Kaustubh (Kaust) Namjoshi, Mike Van Riet, Michael Cook
  • METHODS FOR IDENTIFYING ARRAY AREAS IN DIES FORMED ON A WAFER AND METHODS FOR SETTING UP SUCH METHODS
    Publication number: 20080219545
    Abstract: Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
    Type: Application
    Filed: March 8, 2007
    Publication date: September 11, 2008
    Inventors: Chien-Huei Adam Chen, Ajay Gupta, Richard Wallingford, Kaustubh Kaust Namjoshi, Mike Van Riet, Michael Cook