Abstract: A module for insertion into an expansion slot of a computer includes a primary board and a pair of auxiliary boards. The auxiliary boards are mounted in a spaced relationship on respective sides of the primary board to define air paths between the boards. The air paths allow air to circulate between the boards. The auxiliary boards each have a trace for electrically connecting the board to the primary board, and the primary board has a trace for connecting chips mounted thereon to an interface with the expansion slot. The traces of the auxiliary boards are substantially the same length. The trace of the primary boards is only slightly longer than the traces of the auxiliary boards.

Abstract: A multi-chip package includes a substrate having an opening about the central region. At least two integrated circuit chips are mounted on the substrate. The first chip is connected to one side of the substrate, while the second chip is connected to the other side of the substrate. At least a portion of one of the chips is positioned within the opening, and the chips are vertically stacked. The bottom side of the substrate includes a plurality of interconnect bumps for providing electrical connection to a circuit board or other substrate.

Abstract: An expansion module for mounting in an expansion slot of a computer includes a board with a plurality of apertures formed therein. Each aperture has a first chip package disposed substantially therein and a second chip package mounted to the board in a substantially spaced relationship to the first chip package. An interface is disposed on the board for engaging with the computer. By disposing one of the chip packages within the aperture and the other chip packaged in a spaced relationship therewith, the chip density may be essentially doubled over conventional boards.