Patents by Inventor Kazuaki AOTANI
Kazuaki AOTANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11246239Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.Type: GrantFiled: September 21, 2020Date of Patent: February 8, 2022Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Patent number: 11112186Abstract: A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.Type: GrantFiled: September 2, 2020Date of Patent: September 7, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Patent number: 11085703Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.Type: GrantFiled: September 2, 2020Date of Patent: August 10, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Patent number: 10996001Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.Type: GrantFiled: September 1, 2020Date of Patent: May 4, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Publication number: 20210095930Abstract: The vapor chamber includes a container having a hollow cavity and formed of one plate-shaped member and another plate-shaped member facing the one plate-shaped member that are layered on each other, a working fluid enclosed in the cavity, and a wick structure provided in the cavity. The wick structure includes a first wick part extending from a heat receiving part to a heat discharge part and having a first wick member using a linear member, and a second wick part provided to the heat receiving part and having a second wick member using a linear member. An average diameter the linear member of the second wick member is smaller than an average diameter of the linear member of the first wick member or an aperture dimension of the second wick member is smaller than an aperture dimension of the first wick member.Type: ApplicationFiled: November 24, 2020Publication date: April 1, 2021Applicant: Furukawa Electric Co., Ltd.Inventors: Yoshikatsu Inagaki, Hirofumi Aoki, Daiki Takemura, Hiroshi Okada, Kazuaki Aotani
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Publication number: 20210007246Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200400379Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.Type: ApplicationFiled: September 2, 2020Publication date: December 24, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200400381Abstract: The present disclosure provides a heatsink that includes a lightweight heat transport member having good pressure resistance against atmospheric pressure without impairing flowability of a gas-phase working fluid, and that can equalize a heat input in a heat receiving portion of the heat transport member.Type: ApplicationFiled: September 2, 2020Publication date: December 24, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200393201Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.Type: ApplicationFiled: September 1, 2020Publication date: December 17, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA