Abstract: A vehicle seat includes a support leg connected to a floor to be pivotable about a first axis extending in a horizontal direction; a seat cushion connected to the support leg to be pivotable about a second axis which is parallel to the first axis; a first coupling device provided on the support leg and configured to be detachably coupled with a first coupling part provided on the floor; and a second coupling device provided on the seat cushion and configured to be detachably coupled with a second coupling part provided on the floor. The seat cushion is movable between a stowed position in which the seat cushion is in a lowest position, a first use position in which the first coupling device is coupled with the first coupling part, and a second use position in which the second coupling device is coupled with the second coupling part.

Abstract: Provided is a mount structure including: a board; a conductive layer disposed on the board; a protection layer that is disposed on at least the conductive layer, and has first and second apertures disposed within a region in which the conductive layer is disposed; and an electronic component that is mounted on the board, and has a terminal electrically connected to the conductive layer in a region surrounded by a fringe of the first aperture, wherein a region surrounded by a fringe of the second aperture is an alignment mark that is used to match the location of the terminal of the electronic apparatus to the location of the first aperture.

Abstract: A liquid crystal display apparatus is provided which requires a small, thin and compact area for mounting semiconductor chips for driving liquid crystal and, accordingly, has a reduced cost. Semiconductor chips for driving liquid crystal are mounted on a surface (for example, a first layer) of a multi-layer substrate. The surface has input lines to the chips and output lines from the chips. The input lines have lands for connecting adjacent multi-layer substrates to each other. At least one intermediate layer is formed between an upper layer and a lower layer, the intermediate layer having bus lines. The bus lines and the input lines of the first layer are connected to one another via through holes in the first layer. The output lines of the first layer and terminals of the third layer are connected to one another via through holes in the first, second and third layers.

Abstract: A liquid crystal display apparatus is provided which requires a small, thin and compact area for mounting semiconductor chips for driving liquid crystal and, accordingly, has a reduced cost. Semiconductor chips for driving liquid crystal are mounted on a surface (for example, a first layer) of a multi-layer substrate. The surface has input lines to the chips and output lines from the chips. The input lines have lands for connecting adjacent multi-layer substrates to each other. At least one intermediate layer is formed between an upper layer and a lower layer, the intermediate layer having bus lines. The bus lines and the input lines of the first layer are connected to one another via through holes in the first layer. The output lines of the first layer and terminals of the third layer are connected to one another via through holes in the first, second and third layers.

Abstract: A liquid crystal display apparatus is provided which requires a small, thin and compact area for mounting semiconductor chips for driving liquid crystal and, accordingly, has a reduced cost. Semiconductor chips for driving liquid crystal are mounted on a surface (for example, a first layer) of a multi-layer substrate. The surface has input lines to the chips and output lines from the chips. The input lines have lands for connecting adjacent multi-layer substrates to each other. At least one intermediate layer is formed between an upper layer and a lower layer, the intermediate layer having bus lines. The bus lines and the input lines of the first layer are connected to one another via through holes in the first layer. The output lines of the first layer and terminals of the third layer are connected to one another via through holes in the first, second and third layers.