Patents by Inventor Kazuaki KAWASHITA
Kazuaki KAWASHITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11664240Abstract: The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 ?m and a second metal foil laminated in this order, and patterning the second metal foil.Type: GrantFiled: November 1, 2018Date of Patent: May 30, 2023Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita, Makoto Murakami
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Patent number: 11217445Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.Type: GrantFiled: August 4, 2017Date of Patent: January 4, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita, Youichi Nakajima
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Patent number: 11197379Abstract: The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).Type: GrantFiled: March 29, 2018Date of Patent: December 7, 2021Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuaki Kawashita, Takaaki Ogashiwa, Syunsuke Hirano, Yoshihiro Kato
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Publication number: 20210257207Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.Type: ApplicationFiled: April 9, 2021Publication date: August 19, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Youichi NAKAJIMA
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Patent number: 11081367Abstract: A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).Type: GrantFiled: April 23, 2018Date of Patent: August 3, 2021Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Shunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita
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Patent number: 10964552Abstract: A method for producing a laminate that includes at least the following: providing a first intermediate laminate comprising a carrier substrate including a support therein and a peelable metal layer formed on at least one surface of the carrier substrate; forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support in the carrier substrate from a surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole; stacking and disposing on the surface where the first hole is formed of the second intermediate laminate, an insulating material and a metal foil in this order when viewed from the surface; and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction thereof with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material; and performing treatment with a chemical agent on the third intermediaType: GrantFiled: July 15, 2015Date of Patent: March 30, 2021Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yoshihiro Kato, Takaaki Ogashiwa, Yoichi Nakajima, Takaaki Ichikawa, Kazuaki Kawashita
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Publication number: 20200388506Abstract: The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 ?m and a second metal foil laminated in this order, and patterning the second metal foil.Type: ApplicationFiled: November 1, 2018Publication date: December 10, 2020Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Makoto MURAKAMI
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Patent number: 10727081Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.Type: GrantFiled: June 23, 2017Date of Patent: July 28, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita, Youichi Nakajima
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Publication number: 20200043752Abstract: A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).Type: ApplicationFiled: April 23, 2018Publication date: February 6, 2020Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA
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Publication number: 20200015363Abstract: The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).Type: ApplicationFiled: March 29, 2018Publication date: January 9, 2020Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuaki KAWASHITA, Takaaki OGASHIWA, Syunsuke HIRANO, Yoshihiro KATO
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Publication number: 20190181000Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.Type: ApplicationFiled: August 4, 2017Publication date: June 13, 2019Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Youichi NAKAJIMA
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Publication number: 20190148169Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.Type: ApplicationFiled: June 23, 2017Publication date: May 16, 2019Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Youichi NAKAJIMA
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Publication number: 20170213745Abstract: A laminate including at least providing a first intermediate laminate provided with a carrier substrate including a support and a peelable metal layer formed on at least one surface of the carrier substrate, forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support from the surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole, stacking and disposing on the surface where the first hole is formed, an insulating material and a metal foil in this order when viewed from the surface, and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material, and performing treatment with a chemical agent on the third intermediate laminate.Type: ApplicationFiled: July 15, 2015Publication date: July 27, 2017Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yoshihiro KATO, Takaaki OGASHIWA, Yoichi NAKAJIMA, Takaaki ICHIKAWA, Kazuaki KAWASHITA